5AGXMB1G6F35C6N

The 5AGXMB1G6F35C6N is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA exposed pad package (1152‑FBGA, 35×35). It delivers 300,000 logic elements and approximately 17.36 Mbits of embedded memory, with up to 544 general I/Os, making it suitable for designs that require high logic density and substantial on‑chip RAM.

This device is offered in a commercial grade, RoHS‑compliant package, with a core supply voltage range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C, supporting surface‑mount assembly in compact systems.

Key Features

• High Logic Capacity – 300,000 logic elements provide significant programmable fabric for custom logic and hardware acceleration.
• Logic Array Density – Approximately 14,151 logic blocks to structure large designs and map complex functions efficiently.
• Embedded Memory – Approximately 17.36 Mbits of on‑chip RAM for buffering, scratchpad storage, and memory‑intensive logic.
• Extensive I/O – 544 available I/Os for parallel interfaces, sensor arrays, or multi‑lane connectivity.
• Power and Operating Conditions – Core supply specified from 1.07 V to 1.13 V and commercial operating temperature from 0 °C to 85 °C.
• Packaging and Mounting – 1152‑BBGA (1152‑FBGA, 35×35) with exposed pad, surface mount for compact board integration.
• Compliance – RoHS‑compliant and supplied in a commercial grade suitable for standard embedded and industrial‑adjacent applications.

Typical Applications

• Custom Hardware Acceleration – Use the large logic capacity and embedded RAM to implement accelerators for signal processing, data handling, and algorithm offload.
• Multi‑I/O Control and Bridging – High I/O count supports dense interface routing for protocol bridging, I/O expansion, and complex peripheral management.
• Memory‑Intensive Embedded Functions – On‑chip RAM enables buffering and local data storage for streaming and real‑time processing tasks.
• Compact System Integration – The 1152‑FBGA exposed‑pad package and surface‑mount mounting simplify integration into space‑constrained PCBs and modules.

Unique Advantages

• Scalable Logic Resource – 300,000 logic elements let you scale from moderate to large custom logic implementations without external CPLDs or FPGAs.
• Substantial Embedded Memory – Approximately 17.36 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and LUT‑based designs.
• High I/O Capacity – 544 I/Os provide flexibility for parallel data paths, multiple interfaces, and high‑channel designs.
• Compact, Board‑Ready Package – 1152‑BBGA (35×35) with exposed pad supports thermal coupling and dense board layouts for modern embedded systems.
• Commercial‑Grade and RoHS‑Compliant – Suitable for commercial deployments with environmental compliance for lead‑free assembly.

Why Choose 5AGXMB1G6F35C6N?

The 5AGXMB1G6F35C6N Arria V GX FPGA balances large programmable fabric, significant on‑chip memory, and a high I/O count in a compact 1152‑BBGA package. Its core voltage and operating temperature range are specified for reliable operation in commercial environments, making it a strong choice for engineers building memory‑heavy, I/O‑dense, and compute‑intensive embedded systems.

This device is well suited to teams that need a highly configurable silicon platform with integrated memory and abundant I/O while maintaining a small PCB footprint and RoHS compliance. Its specifications support scalable designs and provide a clear upgrade path within the Arria V family for projects that evolve over time.

Request a quote or submit a sourcing inquiry today to evaluate 5AGXMB1G6F35C6N for your next FPGA‑based design project.