5AGXMB3G4F31C4G

The 5AGXMB3G4F31C4G is an Intel Arria V GX Field Programmable Gate Array supplied in a surface‑mount 896‑BBGA (FCBGA) package. This commercial‑grade FPGA provides a high logic element count, substantial on‑chip RAM, and a large I/O complement for complex, memory‑centric and I/O‑dense designs.

Built for applications that require reconfigurable hardware with high integration density, the device is specified for a core supply voltage range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Logic Capacity — 362,000 logic elements (LEs) and 17,110 CLBs provide ample programmable logic resources for large designs and custom accelerators.
• Embedded Memory — Approximately 19.8 Mbits of on‑chip RAM to support buffering, packet processing, and large local datasets without immediate external memory dependence.
• I/O Density — 384 general‑purpose I/O pins to support wide parallel interfaces, multi‑lane data paths, and dense peripheral connectivity.
• Package & Mounting — Supplied in a 896‑FBGA (31×31) supplier package; 896‑BBGA (FCBGA) case, surface‑mount for PCB integration in space‑constrained designs.
• Power and Thermal — Core voltage operating range of 1.07 V to 1.13 V and commercial operating temperature from 0 °C to 85 °C to match common embedded system environments.
• Compliance — RoHS compliant for environmental compliance in commercial product assemblies.

Typical Applications

• Communication & Networking — Use the device’s high I/O count and large logic capacity for protocol bridging, packet processing, and custom network functions.
• Video & Signal Processing — Leverage substantial on‑chip RAM and logic elements to implement frame buffers, video pipelines, and DSP blocks.
• Hardware Acceleration & Prototyping — Deploy reconfigurable logic and memory resources to prototype custom accelerators or offload compute‑intensive tasks.

Unique Advantages

• High integration in a single package: Combines 362,000 logic elements with ~19.8 Mbits of embedded RAM and 384 I/Os to reduce external component count and simplify system design.
• Compact FCBGA footprint: The 896‑FBGA (31×31) supplier package allows dense PCB layouts while retaining high pin count connectivity.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with mainstream embedded and industrialized commercial products.
• Controlled core power domain: Narrow core voltage range (1.07 V–1.13 V) supports predictable power budgeting and thermal planning.
• Regulatory readiness: RoHS compliance supports inclusion in commercial assemblies with environmental requirements.

Why Choose 5AGXMB3G4F31C4G?

The 5AGXMB3G4F31C4G Arria V GX FPGA delivers a balanced combination of high logic density, significant embedded memory, and a substantial I/O complement in a compact FCBGA package. Its specifications make it suitable for designs that demand reconfigurable compute, extensive on‑chip buffering, and dense peripheral interfacing while operating within standard commercial temperature ranges.

Choose this device for development cycles that require scalable programmable logic resources, predictable power planning, and supplier support through Intel’s Arria V device documentation and tool ecosystem.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical support for the 5AGXMB3G4F31C4G Arria V GX FPGA.