5AGXMB3G4F31C5N

The 5AGXMB3G4F31C5N is an Intel Arria V GX commercial-grade FPGA in an 896-ball FCBGA package. It delivers a large programmable fabric—362,000 logic elements—and a substantial I/O count, packaged for surface-mount assembly.

Designed for applications that require high logic capacity, abundant I/O, and on-chip memory, this device combines a defined core voltage range and commercial operating temperature to support production deployments where those specific parameters are required.

Key Features

• Logic Capacity — 362,000 logic elements provide a high-density programmable fabric for complex logic implementation.
• Embedded Memory — Approximately 19.8 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• Logic Structure — 17,110 CLBs (configurable logic blocks) for structured logic partitioning and resource allocation.
• I/O Count — 384 general-purpose I/Os to support wide peripheral interfacing and multi-channel designs.
• Package — 896-BBGA FCBGA (supplier package: 896-FBGA, 31×31) optimized for high-pin-count board designs and surface-mount assembly.
• Power — Core supply voltage specified at 1.07 V to 1.13 V to match targeted power-rail designs.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting — Surface-mount package suitable for modern PCB assembly processes.
• Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Use the large logic element count and CLB population to implement complex FPGA-based processing and glue logic.
• Multi-channel I/O aggregation — 384 I/Os enable consolidation of numerous peripheral interfaces or parallel data lanes on a single device.
• On-chip buffering and state machines — Approximately 19.8 Mbits of embedded RAM supports buffering, FIFOs, and moderate-sized on-chip memory requirements.

Unique Advantages

• High logic density: 362,000 logic elements make the device suitable for large-scale programmable designs without immediate migration to multiple FPGAs.
• Wide I/O capability: 384 I/Os reduce external interface multiplexing and simplify board-level design for systems with many sensors, peripherals, or data lanes.
• Substantial on-chip memory: Approximately 19.8 Mbits of embedded RAM lowers reliance on external memory for many buffering and state-storage tasks.
• Manufacturing-ready package: 896-BBGA FCBGA (31×31) surface-mount package offers a high-pin-count option compatible with standard PCB assembly workflows.
• Clear operating envelope: Defined core voltage range (1.07–1.13 V) and commercial temperature rating (0 °C–85 °C) help streamline power and thermal planning.
• Regulatory compliance: RoHS compliance supports environmentally restricted designs and regulatory requirements.

Why Choose 5AGXMB3G4F31C5N?

The 5AGXMB3G4F31C5N delivers a combination of large programmable logic capacity, abundant I/O, and meaningful on-chip memory in a high-pin-count FCBGA package. Its documented operating voltage and temperature range make it suitable for commercial production designs that require precise electrical and thermal planning.

Backed by the Arria V device documentation, the part provides the specification-level detail teams need to integrate the device into system designs and production workflows while keeping BOM complexity and external component count manageable.

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