5AGXMB3G4F31C5G

The 5AGXMB3G4F31C5G is a commercial-grade Arria V GX field programmable gate array (FPGA) from Intel. It integrates a high-density logic fabric with substantial on-chip memory and a large I/O count, packaged in a 896-ball fine-pitch BGA (FCBGA) for surface-mount assembly. Typical use cases include compute- and I/O-intensive embedded designs where dense logic, embedded memory, and a high pin-count package are required.

Key Features

• Logic Capacity  Approximately 362,000 logic elements, supporting complex custom logic, datapath, and control implementations.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped logic functions.
• I/O Integration  384 user I/O pins to interface with high-pin-count peripherals, parallel buses, and multi-channel systems.
• Package and Mounting  896-BBGA (FCBGA) supplier package (896-FBGA, 31×31) in a surface-mount form factor for compact, high-density PCB layouts.
• Power  Core voltage supply specified from 1.07 V to 1.13 V, enabling predictable core power design and supply sequencing.
• Temperature Range  Commercial operating range from 0 °C to 85 °C suitable for standard commercial electronic environments.
• Compliance  RoHS-compliant construction for regulatory and environmental conformity.

Typical Applications

• Networking and Telecommunications  High logic density and abundant I/O enable packet processing, protocol bridging, and custom networking accelerators.
• Data Acquisition and Instrumentation  Large embedded RAM and many I/Os support multi-channel data capture, buffering, and pre-processing.
• High-Performance Embedded Systems  Use in custom compute engines or control systems requiring configurable logic and substantial on-chip memory.

Unique Advantages

• High logic density:  Around 362k logic elements provide the capacity to implement complex state machines, datapaths, and custom processors on a single device.
• Substantial embedded memory:  Approximately 19.8 Mbits of RAM reduces external memory dependence for many buffering and local storage needs.
• Large I/O complement:  384 I/O pins enable direct interfaces to multiple peripherals, wide parallel buses, or multi-lane external systems without extensive fanout.
• High-pin-count BGA package:  896-BBGA (31×31) balances routing density and package compactness for advanced PCB designs.
• Predictable power envelope:  Specified core voltage range (1.07–1.13 V) simplifies power-supply design and sequencing considerations.
• Commercial-grade qualification:  Rated for 0 °C to 85 °C operation to match typical commercial product requirements.

Why Choose 5AGXMB3G4F31C5G?

The 5AGXMB3G4F31C5G brings together high logic capacity, meaningful on-chip memory, and a large I/O complement in a single commercial-grade Arria V GX FPGA package. It is appropriate for designers who need to consolidate complex logic, buffering, and multi-interface connectivity into a compact surface-mount solution while maintaining clearly defined electrical and thermal operating parameters.

Documented as part of the Arria V device family, this device is suitable for embedded and system designs that require a balance of integration and predictable electrical characteristics, including core voltage specification and a commercial temperature rating.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5AGXMB3G4F31C5G. Technical documentation is available in the Arria V device datasheet for detailed electrical and configuration specifications.