5AGXMB3G4F31I3N

The 5AGXMB3G4F31I3N is an Arria V GX field‑programmable gate array (FPGA) offered in an industrial grade. It provides a high‑density programmable fabric with 362,000 logic elements, approximately 19.82 Mbits of embedded memory, and 384 I/O pins for large system integration. Designed for surface‑mount deployment in a 896‑BBGA (896‑FBGA, 31×31) package, this device targets industrial applications that require a robust programmable platform with defined operating and power characteristics.

Key Features

• High‑density Logic: 362,000 logic elements to implement large programmable designs and complex custom logic functions.
• Embedded Memory: Approximately 19.82 Mbits of on‑chip RAM for buffering, state storage, and on‑chip data processing.
• Extensive I/O Count: 384 user I/Os to support broad connectivity and parallel interfacing with external devices and subsystems.
• Package & Mounting: 896‑BBGA (supplier package: 896‑FBGA, 31×31) in a surface‑mount form factor for compact board designs.
• Power Supply: Core voltage supply specified between 1.12 V and 1.18 V to match system power rails and design constraints.
• Industrial Temperature Range: Operating range from −40 °C to 100 °C to meet temperature demands of industrial deployments.
• Compliance: RoHS‑compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Systems: Programmable logic for industrial control platforms that benefit from industrial temperature rating and a high I/O count.
• Embedded Processing and Integration: On‑chip memory and dense logic fabric for consolidating custom processing functions and peripheral interfaces.
• High‑Density I/O Aggregation: Systems that require large numbers of external connections and parallel data paths using the device's 384 I/Os.

Unique Advantages

• Large Logic Capacity: 362,000 logic elements enable implementation of complex algorithms and substantial custom logic without immediate need for external ASICs.
• Significant On‑Chip Memory: Approximately 19.82 Mbits of embedded RAM reduces reliance on external memory for many buffering and data‑path tasks.
• High I/O Integration: 384 I/Os simplify board-level routing and system integration by supporting many peripherals and interfaces directly.
• Industrial‑Grade Robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Compact, Surface‑Mount Package: 896‑BBGA (31×31) offers a high pin count in a compact footprint suitable for space‑constrained designs.
• Regulatory Alignment: RoHS compliance supports environmentally conscious manufacturing and supply‑chain requirements.

Why Choose 5AGXMB3G4F31I3N?

The 5AGXMB3G4F31I3N Arria V GX FPGA combines high logic density, substantial embedded memory, and a large I/O complement in an industrial‑rated, surface‑mount 896‑BBGA package. Its defined core voltage range and wide operating temperature window make it suitable for engineers designing robust, integrated systems where consolidation of custom logic and significant on‑chip resources are required.

This device is appropriate for design teams focused on industrial deployments and complex system integration, offering scalability and a platform that aligns with established Arria V device specifications for electrical and configuration characteristics.

Request a quote or submit a pricing inquiry to receive availability, lead time, and ordering details for 5AGXMB3G4F31I3N. Technical documentation is available to support evaluation and integration into your design cycle.