5AGXMB3G4F35C4G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA

Quantity 224 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXMB3G4F35C4G – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXMB3G4F35C4G is an Intel Arria V GX family FPGA offered in a commercial grade package. It provides a high logic capacity architecture with 362,000 logic elements and approximately 19.8 Mbits of on‑chip RAM, paired with a large 544‑pin I/O resource set. The device is supplied in a 1152‑FBGA (35 × 35 mm) FCBGA package and operates within a core voltage range of 1.07 V to 1.13 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic Capacity  362,000 logic elements to support complex, high‑density logic implementations.
  • Embedded Memory  Approximately 19.8 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive functions.
  • High I/O Count  544 user I/O pins to accommodate extensive peripheral interfaces and board‑level connectivity.
  • Package  1152‑FBGA, FCBGA (35 × 35 mm) footprint for a compact board layout while supporting many I/Os.
  • Power and Supply  Defined core supply range of 1.07 V to 1.13 V for predictable power design and rail budgeting.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C for standard embedded and system applications.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High‑density custom logic designs  Suitable where up to 362,000 logic elements are required to implement complex finite state machines, custom datapaths, or protocol engines.
  • Memory‑intensive functions  Use the approximately 19.8 Mbits of embedded RAM for packet buffering, lookup tables, or on‑chip storage to reduce external memory dependence.
  • Multi‑interface systems  The 544 I/O pins support designs that require many simultaneous external connections, parallel buses, or multiple peripheral interfaces.

Unique Advantages

  • High logic density: 362,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM and board area.
  • Substantial on‑chip memory: Approximately 19.8 Mbits of embedded RAM supports larger on‑chip buffers and state storage, improving deterministic behavior.
  • Extensive I/O resources: 544 I/Os provide flexibility for interfacing to sensors, buses, and peripherals without immediate need for external GPIO expanders.
  • Compact BGA package: 1152‑FBGA (35 × 35 mm) helps contain solution size while supporting a high pin count for dense system designs.
  • Commercial operating range: 0 °C to 85 °C aligns with typical commercial embedded system environments and simplifies thermal planning.
  • RoHS compliance: Meets regulatory requirements for lead‑free manufacturing flows.

Why Choose 5AGXMB3G4F35C4G?

The 5AGXMB3G4F35C4G Arria V GX FPGA combines a large logic fabric, significant on‑chip RAM, and a high I/O count in a compact 1152‑FBGA package. Its defined core voltage range and commercial temperature rating make it suitable for mainstream embedded and system designs that need high logic and memory capacity without relying on external resources. The Arria V family datasheet and device specifications provide the electrical and configuration details necessary for integration into professional designs.

Engineers and procurement teams looking for a high‑capacity, commercial‑grade FPGA with extensive I/O and embedded memory will find this device well suited to consolidate functionality and streamline board-level integration.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead‑time information for 5AGXMB3G4F35C4G.

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