5AGXMB3G4F31I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA |
|---|---|
| Quantity | 621 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXMB3G4F31I5G – Arria V GX Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA
The 5AGXMB3G4F31I5G is an Intel Arria V GX family FPGA offered in an industrial-grade device and packaged in a 896-ball FCBGA (31 × 31) surface-mount package. It delivers high logic capacity, substantial embedded RAM, and a large I/O count for designs that require dense programmable logic and extensive peripheral connectivity.
Designed for systems operating across a wide temperature range with a tightly specified core voltage, this device targets applications that demand a combination of logic density, on-chip memory, and robust I/O integration.
Key Features
- Logic Capacity Provides 362,000 logic elements for complex, high-density programmable logic implementations.
- On-chip Memory Approximately 19.8 Mbits of embedded memory (19,822,592 total RAM bits) to support buffering, tables, and packet processing on chip.
- I/O Density 384 user I/O pins to support extensive external interfacing and parallel buses.
- Package & Mounting 896-BBGA (FCBGA) surface-mount package in a 31 × 31 mm footprint for board-level integration where high pin count and compact area are required.
- Power Supply Core voltage specified at 1.07 V to 1.13 V for predictable power delivery and margin planning.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C, suitable for industrial operating environments.
- RoHS Compliance Device is RoHS compliant for environmental and regulatory conformity.
Typical Applications
- High-density programmable logic Implement complex logic functions and custom datapaths using the device’s large logic capacity and on-chip memory.
- Board-level integration with dense I/O Use the 384 I/Os and 896-ball FCBGA package to connect multiple peripherals and high-pin-count interfaces at the board level.
- Industrial systems Deploy in designs that require extended temperature operation and industrial-grade components.
Unique Advantages
- High logic density: 362,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
- Substantial embedded memory: Approximately 19.8 Mbits of on-chip RAM supports buffering and data-intensive tasks without external memory.
- Extensive I/O capability: 384 I/Os provide flexibility for parallel interfaces, high-pin-count peripherals, and board-level routing schemes.
- Industrial-grade thermal range: Rated from –40 °C to 100 °C to meet rigorous environmental requirements.
- Compact, high-pin-count package: 896-BBGA (31 × 31) FCBGA package balances pin density and PCB area for space-constrained designs.
- Predictable core supply: Narrow core voltage range (1.07 V to 1.13 V) simplifies power-supply design and verification.
Why Choose 5AGXMB3G4F31I5G?
5AGXMB3G4F31I5G positions itself as a high-density Arria V GX FPGA option for designs needing significant logic resources, on-chip memory, and broad I/O connectivity within an industrial operating envelope. Its combination of 362,000 logic elements, approximately 19.8 Mbits of embedded RAM, and 384 I/Os in a 896-ball FCBGA package makes it suitable for systems where integration and predictable power/thermal characteristics matter.
Engineers and procurement teams will find this part suited to long-life projects that require robust, high-capacity programmable logic with RoHS compliance and clearly defined electrical and thermal operating ranges.
Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information on the 5AGXMB3G4F31I5G.

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