5AGXMB3G4F31I3G

The 5AGXMB3G4F31I3G is an Arria V GX Field Programmable Gate Array (FPGA) in an 896‑ball BGA (FCBGA) package, designed for surface‑mount assembly. This industrial‑grade device delivers a high logic element count and substantial on‑chip memory for dense digital implementations.

With 362,000 logic elements, 384 user I/O pins and approximately 19.8 Mbits of embedded memory, the device targets applications that require large programmable logic capacity, significant embedded RAM, and a robust operating temperature range.

Key Features

• Core Logic – 362,000 logic elements suitable for large, complex digital designs and high‑density logic implementations.
• Embedded Memory – Approximately 19.8 Mbits of on‑chip RAM to support buffers, FIFOs and local data storage without external memory dependency.
• I/O and Periphery – 384 user I/O pins to support extensive peripheral and system interfacing requirements.
• Package and Mounting – 896‑BBGA, FCBGA (896‑FBGA, 31×31) surface‑mount package for compact, high‑pin‑count board designs.
• Power – Core supply operating range specified between 1.12 V and 1.18 V for controlled power design and supply planning.
• Thermal and Reliability – Industrial grade with an operating temperature range from –40 °C to 100 °C for deployment in demanding environments.
• Compliance – RoHS compliant.
• Documentation – Device electrical and configuration characteristics are documented in the Arria V device datasheet.

Typical Applications

• High‑density programmable logic modules – Systems that require hundreds of thousands of logic elements and significant embedded RAM for complex custom logic.
• Industrial control and automation – Embedded controllers and signal processing units that benefit from industrial temperature range and high I/O count.
• Communication and networking equipment – Interfaces and protocol processing that leverage abundant I/O and on‑chip memory for buffering and packet handling.

Unique Advantages

• High logic capacity: 362,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board‑level integration complexity.
• Significant on‑chip memory: Approximately 19.8 Mbits of embedded RAM supports local data storage and high‑throughput buffering without immediate need for external memory.
• Extensive I/O resources: 384 user I/O pins provide flexible interfacing to peripherals, sensors and high‑speed front‑ends.
• Industrial temperature range: Rated for –40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Compact, high‑pin package: 896‑BBGA (31×31) FCBGA enables dense routing and compact board footprint for space‑constrained designs.
• RoHS compliant: Meets regulatory requirements for lead‑free assemblies.

Why Choose 5AGXMB3G4F31I3G?

The 5AGXMB3G4F31I3G positions itself as a high‑capacity Arria V GX FPGA option for designs that demand large programmable logic resources, substantial embedded memory and high I/O density. Its industrial grade specification and broad operating temperature range make it suitable for challenging environments where reliability is required.

Engineers and procurement teams can rely on the documented electrical characteristics and configuration details provided in the Arria V device datasheet when planning power, thermal and I/O integration. This device is appropriate for projects that require scalability in logic and memory while maintaining a compact board footprint.

Request a quote or submit an RFQ to inquire about pricing, availability and lead times for the 5AGXMB3G4F31I3G.