5AGXMB3G4F31I5N

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA

Quantity 178 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXMB3G4F31I5N – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXMB3G4F31I5N is an Arria V GX Field Programmable Gate Array in an industrial grade offering. It integrates a high-density programmable fabric with substantial on-chip memory and a large I/O count, enabling complex, high-channel-count designs where integration and thermal robustness are required.

This device is optimized for applications that demand a combination of large logic capacity, on-chip buffering, and dense external interfacing while operating across an industrial temperature range. Comprehensive electrical, switching, configuration, and I/O timing specifications are provided in the Arria V device datasheet.

Key Features

  • Logic Capacity — 362,000 logic elements to implement complex custom logic and system-level functions.
  • Embedded Memory — approximately 19.8 Mbits of embedded memory for on-chip buffering, FIFOs, and data storage.
  • I/O Density — 384 user I/Os to support high-pin-count interfaces and multi-channel connectivity.
  • Power Domain — Core voltage supply range of 1.07 V to 1.13 V for defined power sequencing and budgeting.
  • Package & Mounting — 896-BBGA (FCBGA) package; supplier device package 896-FBGA (31×31); surface-mount mounting for compact PCB implementation.
  • Industrial Qualification — Industrial grade device with operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Standards Compliance — RoHS-compliant material declaration.
  • Documented Specifications — Full Arria V device datasheet provides electrical characteristics, switching performance, configuration timing, and I/O timing details for system design and validation.

Typical Applications

  • High-performance embedded systems — Implement custom datapaths and system control with large logic capacity and substantial on-chip memory.
  • Multi-channel interface and aggregation — 384 I/Os enable dense connectivity for bridging, protocol conversion, and I/O expansion tasks.
  • Signal processing and hardware acceleration — Use the large logic fabric and embedded memory to offload compute-intensive kernels and buffering functions.
  • Prototyping and system integration — Leverage the programmable fabric and comprehensive datasheet guidance to validate hardware architectures before production.

Unique Advantages

  • High-density programmable logic: 362,000 logic elements provide headroom for complex logic, state machines, and custom accelerators.
  • Significant on-chip memory: Approximately 19.8 Mbits of embedded RAM reduces external memory dependence for buffering and low-latency storage.
  • Large I/O complement: 384 I/Os support wide parallel interfaces and multiple peripheral connections without external multiplexing.
  • Industrial thermal range: Rated from −40 °C to 100 °C for deployment where extended temperature operation is required.
  • Compact, high-pin-count package: 896-BBGA (31×31) FCBGA offers a high pin count in a compact footprint for dense PCB layouts.
  • Regulatory compliance: RoHS-compliant construction supports environmentally conscious procurement requirements.

Why Choose 5AGXMB3G4F31I5N?

The 5AGXMB3G4F31I5N Arria V GX FPGA combines large-scale programmable logic, substantial embedded memory, and a high I/O count within an industrial-grade package. This combination supports system designs that require on-chip integration of complex logic, multi-channel interfaces, and robust operation across a wide temperature range.

Designers and procurement teams seeking scalability, detailed electrical and configuration documentation, and a high-density FCBGA package will find this device suitable for demanding embedded and system-level FPGA implementations.

Request a quote or submit an inquiry for 5AGXMB3G4F31I5N to discuss availability, pricing, and delivery timelines.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up