5AGXMB3G4F35C5N

The 5AGXMB3G4F35C5N is an Arria V GX Field Programmable Gate Array (FPGA) from Intel, provided in a 1152-BBGA FCBGA package with exposed pad. It delivers a high logic element count and large on-chip RAM for complex digital designs that require substantial programmable logic and on-chip memory.

With 362,000 logic elements, approximately 19.8 Mbits of embedded memory, and 544 user I/Os, this commercial-grade FPGA is suitable for designs that demand high logic density, extensive I/O capacity, and compact surface-mount packaging.

Key Features

• Logic Capacity — 362,000 logic elements to support large-scale programmable logic implementations and complex logic architectures.
• On-chip Memory — Approximately 19.8 Mbits of embedded RAM for local buffering, state storage, and memory-intensive logic functions.
• High I/O Count — 544 user I/O pins enabling broad interfacing options for multi-channel systems and dense peripheral connectivity.
• Package & Mounting — 1152-BBGA, FCBGA exposed pad package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting type for PCB assembly.
• Power Supply Range — Core voltage specified between 1.07 V and 1.13 V to guide system power design and regulator selection.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operating temperature suitable for commercial-environment applications.
• Regulatory Compliance — RoHS-compliant for environmental and lead-free assembly considerations.

Typical Applications

• High-density digital processing — Use the large logic capacity and embedded memory to implement complex DSP blocks, packet processing, or parallel computation engines.
• I/O-intensive system controllers — Leverage 544 I/Os to connect numerous peripherals, sensors, or external interfaces in compact embedded systems.
• Memory-buffered logic — Employ the approximately 19.8 Mbits of on-chip RAM for local buffering, FIFOs, and temporary data storage within throughput-critical logic paths.
• Compact PCB implementations — The 1152-BBGA FCBGA exposed pad package and surface-mount profile support space-constrained board layouts and thermal management via exposed pad.

Unique Advantages

• Substantial programmable capacity: 362,000 logic elements provide the headroom needed for large logic designs without external glue logic.
• Significant embedded memory: Approximately 19.8 Mbits of on-chip RAM reduces reliance on external memory for many buffering and stateful functions.
• Extensive connectivity: 544 I/Os enable flexible interfacing and integration of multiple peripherals and parallel channels.
• Compact, assembly-friendly package: 1152-BBGA FCBGA with exposed pad supports efficient PCB mounting and thermal conduction in dense designs.
• Design-grade specifications: Commercial temperature rating (0 °C to 85 °C) and a defined core voltage window (1.07 V–1.13 V) simplify system-level validation and power planning.
• RoHS compliant: Meets lead-free and environmental requirements for modern electronics manufacturing.

Why Choose 5AGXMB3G4F35C5N?

The 5AGXMB3G4F35C5N positions itself as a high-capacity Arria V GX FPGA option for commercial designs that require a combination of large programmable logic, substantial on-chip memory, and broad I/O resources in a compact BGA package. Its specified core voltage range and commercial operating temperature make it straightforward to integrate into standard embedded systems and digital platforms.

This FPGA is well suited to engineering teams building complex, I/O-rich systems that benefit from integrated memory and dense logic, while maintaining board-level compactness and RoHS-compliant assembly. Backed by Intel’s Arria V device documentation and specifications, it provides a verifiable platform for mid- to high-complexity FPGA implementations.

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