5AGXMB3G4F40C4G

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA, FCBGA

Quantity 1,025 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA, FC (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXMB3G4F40C4G – Arria V GX Field Programmable Gate Array (FPGA)

The 5AGXMB3G4F40C4G is an Intel Arria V GX Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA FCBGA package. It provides a high-density programmable fabric with 362,000 logic elements and approximately 19.8 Mbits of embedded memory, paired with 704 user I/O pins for extensive system interfacing.

Engineered for commercial-grade applications, this device supports a core voltage supply range of 1.07 V to 1.13 V and operates across a 0 °C to 85 °C temperature range. Its combination of logic density, on-chip memory and I/O capacity makes it suitable for complex, highly integrated FPGA designs.

Key Features

  • Logic Capacity  Provides 362,000 logic elements to support complex programmable designs and high gate counts.
  • Embedded Memory  Includes approximately 19.8 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
  • I/O Density  Features 704 user I/O pins to support extensive peripheral interfaces, parallel buses, and high-pin-count system integration.
  • Package & Mounting  Supplied in a 1517-BBGA (FCBGA) package, supplier package listed as 1517-FBGA, FC (40×40), and designed for surface-mount assembly.
  • Power and Operating Range  Core supply voltage specified between 1.07 V and 1.13 V, enabling predictable power planning and supply design.
  • Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C, suitable for standard commercial applications.
  • Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

  • High-density programmable logic systems  Leverages 362,000 logic elements and abundant embedded RAM to implement complex custom logic, DSP functions, and algorithm acceleration.
  • Multi‑I/O interface designs  704 I/O pins enable integration of wide parallel interfaces, multi-channel sensors, and high-pin-count peripherals.
  • Embedded system prototyping and integration  Combines logic density and on-chip memory to consolidate functions and reduce external component count in commercial products.

Unique Advantages

  • High logic density: 362,000 logic elements allow implementation of large-scale programmable designs without immediate escalation to multiple devices.
  • Substantial on-chip memory: Approximately 19.8 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention, simplifying board design.
  • Extensive I/O support: 704 user I/O pins provide flexible interface options and simplify integration with diverse peripherals and subsystems.
  • Compact surface-mount package: 1517-BBGA (40×40) FCBGA format enables high-density board layouts while maintaining robust thermal and electrical characteristics.
  • Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • Regulatory compliance: RoHS compliance supports lead-free manufacturing and environmental compliance requirements.

Why Choose 5AGXMB3G4F40C4G?

The 5AGXMB3G4F40C4G Arria V GX FPGA positions itself as a high-capacity, commercially rated programmable logic device for designs that require large logic resources, significant on-chip memory, and broad I/O connectivity. Its specified core voltage range and surface-mount FCBGA package support predictable power delivery and compact board-level integration.

This device suits engineering teams building complex FPGA-based systems that prioritize integration density and I/O flexibility while adhering to commercial temperature and RoHS requirements. Backed by Intel’s Arria V device family documentation, it provides a clearly specified foundation for scalable, long-term product development.

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