5AGXMB3G4F40C5G

The 5AGXMB3G4F40C5G is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel offered in a 1517-BBGA package. This commercial-grade, surface-mount device integrates 362,000 logic elements and approximately 19.8 Mbits of on-chip RAM, making it suitable for dense, I/O-rich digital designs requiring substantial programmable logic and embedded memory. The device supports a wide I/O count and operates within defined core voltage and temperature ranges for predictable system integration.

Key Features

• High-density logic  Provides 362,000 logic elements for complex custom digital implementations and large-scale parallel processing.
• Embedded memory  Approximately 19.8 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic blocks.
• Extensive I/O  704 available I/O pins to accommodate multi-interface boards and high-pin-count connectivity requirements.
• Package and mounting  Delivered in a 1517-BBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for compact board-level integration.
• Core supply range  Operates with a core voltage supply between 1.07 V and 1.13 V to meet system power design constraints.
• Commercial temperature rating  Specified for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant  Environmental compliance for assemblies requiring RoHS-conforming components.

Typical Applications

• I/O‑intensive systems  Use the device’s 704 I/O pins to aggregate and route multiple interfaces or sensors on a single FPGA.
• High-density custom logic  Leverage 362,000 logic elements to implement complex state machines, accelerators, or protocol engines.
• On-chip buffering and memory  Take advantage of approximately 19.8 Mbits of embedded memory for local buffering, packet queues, or intermediate data storage.
• Compact board-level integration  The 1517-BBGA / 1517-FBGA (40×40) surface-mount package allows integration into space-constrained PCBs.

Unique Advantages

• High logic capacity: 362,000 logic elements enable large-scale programmable designs without immediate need for external logic expansion.
• Significant embedded RAM: Approximately 19.8 Mbits of on-chip memory reduces dependency on external RAM for many intermediate data tasks.
• Large I/O complement: 704 I/Os simplify multi-interface designs and reduce the need for external multiplexing or interface chips.
• Commercial-grade thermal range: Specified operation from 0 °C to 85 °C aligns with typical commercial product deployments.
• Industry-standard package: 1517-FBGA (40×40) supplier package and surface-mount form factor support modern assembly flows and compact PCB layouts.
• Regulatory alignment: RoHS compliance supports environmentally restricted product builds.

Why Choose 5AGXMB3G4F40C5G?

The 5AGXMB3G4F40C5G delivers a balanced combination of high logic density, substantial embedded memory, and a very large I/O count within a compact surface-mount FBGA package. It is positioned for engineering teams building I/O-heavy, memory-dependent, or compute-dense programmable logic solutions in commercial environments where predictable voltage and temperature operating windows are required.

For designers seeking scalable programmable logic with significant on-chip resources and a standard package footprint, this Arria V GX device provides a robust foundation that aligns with standard commercial system-level requirements and RoHS-directed manufacturing processes.

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