5AGXMB3G4F40I5N

The 5AGXMB3G4F40I5N is an Intel Arria V GX field-programmable gate array supplied in a 1517-BBGA (1517-FBGA, 40×40) package. The device provides a high-density programmable fabric—362,000 logic elements—with approximately 19.8 Mbits of embedded RAM and up to 704 I/O pins. Specified for industrial use, it operates across a core supply range of 1.07 V to 1.13 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  362,000 logic elements provide large-scale programmable logic capacity for complex designs.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM to support buffering, state storage, and high-throughput data paths.
• I/O Density  Up to 704 general-purpose I/O pins to accommodate wide external interfaces and parallel connectivity.
• Package  1517-BBGA (supplier device package 1517-FBGA, 40×40) surface-mount package for compact, high-density board integration.
• Power  Core supply voltage specified from 1.07 V to 1.13 V to match regulated power-rail designs and allow precise power budgeting.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in temperature-challenging environments.
• RoHS Compliant  Meets RoHS environmental compliance requirements.

Typical Applications

• High-density programmable logic systems  Designs that require hundreds of thousands of logic elements and substantial embedded RAM for custom processing pipelines.
• I/O‑intensive platforms  Systems that need up to 704 I/Os for parallel interfaces, wide buses, or mixed-signal front ends.
• Industrial equipment  Applications requiring industrial-grade temperature operation (−40 °C to 100 °C) and surface-mount packaging for PCB assembly.
• Power-budget-conscious designs  Projects that must operate within a narrow core voltage window (1.07 V–1.13 V) for predictable power management.

Unique Advantages

• High logic capacity: 362,000 logic elements enable implementation of large custom hardware functions without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 19.8 Mbits of embedded memory reduce reliance on external memory for buffering and state retention.
• Extensive I/O resources: 704 I/Os simplify system-level integration by providing direct connectivity to multiple peripherals and buses.
• Industrial-rated thermal range: Specified −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact package for dense boards: 1517-BBGA (40×40) surface-mount package supports high-density PCBs while maintaining mechanical and electrical integrity.
• Regulated core supply window: Tight 1.07 V–1.13 V specification assists in consistent power sequencing and thermal planning.

Why Choose 5AGXMB3G4F40I5N?

The 5AGXMB3G4F40I5N Arria V GX FPGA delivers a combination of large programmable logic capacity, significant embedded memory, and high I/O count in a compact 1517-BBGA package. Its industrial temperature rating and defined core-voltage window make it suitable for applications that require consistent behavior across a wide thermal range and predictable power delivery.

This device is targeted at engineering teams and procurement specialists designing systems that demand substantial on-chip resources, dense external connectivity, and ruggedized operating conditions—providing a scalable, integrated FPGA platform backed by detailed device specifications.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for the 5AGXMB3G4F40I5N Arria V GX FPGA.