5AGXMB3G6F35C6G

The 5AGXMB3G6F35C6G is an Arria V GX field-programmable gate array (FPGA) IC from Intel. It delivers high logic capacity and substantial on-chip RAM in a high-density FCBGA package, making it suitable for designs that require large programmable logic fabrics combined with extensive I/O connectivity.

Designed as a commercial-grade device, the part operates on a core supply range of 1.07 V to 1.13 V and across an ambient range of 0 °C to 85 °C. The device is RoHS compliant and supplied in a surface-mount 1152-BBGA (1152-FBGA, FC, 35×35) package.

Key Features

• Core Logic Capacity — 362,000 logic elements for dense, programmable logic implementations.
• Embedded Memory — approximately 19.8 Mbits of on-chip RAM to support large buffering, state machines, and data processing workloads.
• I/O Density — 544 user I/O pins for high-channel-count interfacing and multi-protocol front-end connectivity.
• Power & Operating Range — Core voltage supply specified from 1.07 V to 1.13 V; commercial operating temperature range 0 °C to 85 °C.
• Package & Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA, FC (35×35).
• Compliance — RoHS compliant for global electronics manufacturing environments.

Typical Applications

• Communications and Networking — High logic capacity and large I/O count enable complex packet processing, protocol bridging, and interface aggregation.
• Signal and Video Processing — Substantial embedded RAM and dense logic resources support real-time data buffering and pipeline processing tasks.
• High‑I/O Control Systems — 544 I/O pins accommodate multi-channel sensor, actuator, and peripheral interfaces in industrial and instrumentation designs.
• Prototyping and Platform Development — Commercial-grade Arria V GX FPGA suitable for development platforms that require a balance of logic density, memory, and connectivity.

Unique Advantages

• High-density programmable fabric — 362,000 logic elements provide the headroom for complex custom logic and algorithm implementation.
• Significant on-chip memory — approximately 19.8 Mbits of RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O resources — 544 I/O pins simplify system integration and reduce the need for external multiplexing or interface chips.
• Compact, manufacturable package — 1152-BBGA surface-mount packaging enables high-density board designs while aligning with standard assembly processes.
• Commercial-grade availability — Specified operating temperature and voltage range for mainstream embedded and industrial-adjacent applications.

Why Choose 5AGXMB3G6F35C6G?

The 5AGXMB3G6F35C6G Arria V GX FPGA combines a large programmable logic fabric with substantial embedded RAM and a high I/O count in a compact FCBGA package. It is well suited for designers who need dense logic, on-chip memory, and broad interfacing capability within a commercial-grade device.

Backed by Intel's Arria V device family specifications and documentation, this device is appropriate for system designs that prioritize integration, scalable logic resources, and flexible I/O—delivering a platform that supports complex processing and connectivity requirements.

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