5AGXMB3G6F40C6N

The 5AGXMB3G6F40C6N is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 1517-ball BGA package. This commercial‑grade, surface‑mount device delivers high logic capacity and on‑chip memory for complex, customizable digital designs.

Key device metrics include approximately 362,000 logic elements, roughly 19.8 Mbits of embedded memory, and 704 user I/O pins. The device operates from a core voltage range of 1.07 V to 1.13 V and supports an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity — Approximately 362,000 logic elements to implement large-scale programmable logic and custom datapaths.
• Embedded Memory — Approximately 19.8 Mbits of on‑chip RAM for buffering, FIFOs, and distributed storage without external memory for many functions.
• High I/O Count — 704 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 1517‑BBGA package (supplier package: 1517‑FBGA, 40×40) designed for surface‑mount assembly.
• Power — Core supply specified between 1.07 V and 1.13 V to match board power delivery design requirements.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• Compliance — RoHS‑compliant manufacturing status.

Typical Applications

• Custom Logic and Acceleration — Deploy the device where up to 362,000 logic elements and on‑chip RAM are required for application‑specific acceleration or algorithm implementation.
• High‑I/O Systems — Use in designs that require extensive parallel connectivity or multiple external interfaces enabled by 704 I/O pins.
• Embedded Processing and Buffering — Leverage approximately 19.8 Mbits of embedded RAM for local buffering, packet queues, or streaming data paths.

Unique Advantages

• Substantial Logic Density: Approximately 362,000 logic elements enable implementation of complex programmable functions on a single device.
• Significant Embedded Memory: Nearly 19.8 Mbits of RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O Availability: 704 I/O pins provide flexibility for broad interfacing and parallel data throughput.
• Board‑Level Integration: 1517‑BBGA/1517‑FBGA (40×40) package supports compact, surface‑mount assembly for dense board layouts.
• Commercial Temperature Rating: Designed for 0 °C to 85 °C operation to meet standard commercial product requirements.
• Regulatory Compliance: RoHS‑compliant manufacturing supports environmental and regulatory objectives.

Why Choose 5AGXMB3G6F40C6N?

The 5AGXMB3G6F40C6N Arria V GX FPGA combines high logic capacity, substantial on‑chip memory, and a large I/O complement in a compact BGA package, making it suitable for demanding commercial designs that require programmable hardware resources. Its specified core voltage and commercial temperature range provide clear electrical and environmental parameters for system integration.

This device is well suited to engineers and system designers targeting high‑density programmable logic, extensive interfacing, and significant on‑chip buffering while maintaining RoHS compliance and surface‑mount assembly compatibility.

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