5AGXMB5G4F35C5N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 23625728 420000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 690 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 19811 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23625728 |
Overview of 5AGXMB5G4F35C5N – Arria V GX Field Programmable Gate Array (FPGA), 420,000 logic elements, 544 I/Os, 1152-BBGA
The 5AGXMB5G4F35C5N is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in a commercial-grade package. It delivers a high-density programmable fabric with 420,000 logic elements and a large I/O count, suitable for designs that require substantial logic capacity and extensive peripheral connectivity.
Built for surface-mount system integration, this device combines on-chip memory, a broad I/O complement, and a low-voltage core operating range to support complex digital processing and system integration tasks within the commercial temperature envelope.
Key Features
- Programmable Fabric Contains 420,000 logic elements, enabling complex logic implementation and high-density designs.
- Logic Blocks Includes 19,811 logic blocks for structured placement of combinational and sequential logic resources.
- Embedded Memory Approximately 23.6 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
- High I/O Count 544 I/O pins provide extensive peripheral connectivity for multi-channel interfaces and system integration.
- Package & Mounting 1152-BBGA (FCBGA exposed pad), supplier package 1152-FBGA (35×35), optimized for surface-mount assembly and thermal path through the exposed pad.
- Power Core supply voltage range specified at 1.07 V to 1.13 V for the device core.
- Operating Temperature Commercial grade operation from 0 °C to 85 °C.
- Regulatory RoHS compliant.
- Manufacturer Intel Arria V GX family device with documented electrical and configuration specifications in the device datasheet.
Typical Applications
- High-density digital processing Leverage large logic capacity and on-chip RAM for complex signal processing and algorithm acceleration.
- Multi-channel I/O systems Use the 544 I/Os to aggregate and interface with multiple peripherals, sensors, or communication channels.
- System integration and prototyping Surface-mount FCBGA package and exposed pad support compact board-level integration for development and production designs.
Unique Advantages
- Large programmable capacity: 420,000 logic elements enable implementation of complex designs without external logic expansion.
- Extensive on-chip memory: Approximately 23.6 Mbits of embedded RAM reduces reliance on external memory for buffering and LUT-intensive functions.
- High I/O scalability: 544 I/Os provide flexibility for dense peripheral and interface routing on a single device.
- Compact, manufacturable package: 1152-BBGA FCBGA with exposed pad supports thermal management and automated surface-mount assembly flows.
- Controlled power envelope: Defined core voltage range (1.07 V–1.13 V) for predictable power planning and supply design.
- Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial products.
Why Choose 5AGXMB5G4F35C5N?
The 5AGXMB5G4F35C5N Arria V GX FPGA balances high logic density, significant embedded memory, and a wide complement of I/Os in a surface-mount 1152-BBGA package. It is suited to engineers and system designers who need a programmable device capable of integrating substantial digital functionality and multiple interfaces within a commercial temperature range.
Backed by Intel's device documentation and electrical specifications, this FPGA offers predictable power and thermal characteristics for platform-level design and long-term maintainability in production environments.
Request a quote or submit a sales inquiry referencing part number 5AGXMB5G4F35C5N to obtain pricing, availability, and ordering information.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018