5AGXMB3G6F31C6N

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 19822592 362000 896-BBGA, FCBGA

Quantity 482 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXMB3G6F31C6N – Arria V GX FPGA, 896-BBGA (FCBGA)

The 5AGXMB3G6F31C6N is an Arria V GX Field Programmable Gate Array (FPGA) in a 896-ball FCBGA package. It delivers large on-chip logic and memory capacity with a wide set of I/O, packaged for surface-mount PCB assembly.

Built for commercial-grade applications, this device provides substantial reconfigurable logic resources, embedded memory, and flexible I/O in a compact 31 × 31 mm package while operating within a defined low-voltage core supply range.

Key Features

  • Core Capacity — Approximately 362,000 logic elements and 17,110 logic blocks for implementing complex, highly parallel designs.
  • Embedded Memory — Approximately 19.8 Mbits of on-chip RAM to support buffering, large state machines, and data-path storage.
  • I/O Resources — 384 user I/O pins to interface with high-density peripheral, sensor, and mezzanine connections.
  • Power — Core voltage supply range from 1.07 V to 1.13 V for defined power and timing behavior.
  • Package & Mounting — 896-BBGA (FCBGA) / supplier device package 896-FBGA (31 × 31 mm) in a surface-mount form factor for compact board integration.
  • Commercial Grade — Specified for commercial operation with an operating temperature range from 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-density logic designs — Deploy where hundreds of thousands of logic elements and extensive on-chip memory are required to implement complex algorithms and parallel datapaths.
  • I/O-intensive systems — Suitable for designs that require large numbers of user I/Os for interfacing with peripherals, sensors, or mezzanine modules.
  • Compact, surface-mount assemblies — Use in space-constrained boards that benefit from a 31 × 31 mm FCBGA footprint and surface-mount mounting.

Unique Advantages

  • High logic density: 362,000 logic elements enable implementation of large, integrated digital functions without external glue logic.
  • Significant on-chip RAM: Approximately 19.8 Mbits of embedded memory reduces dependence on external memory for many buffer and state-storage requirements.
  • Large I/O count: 384 user I/Os provide flexibility for diverse interfacing needs and multi-channel deployments.
  • Compact package: 896-ball FCBGA in a 31 × 31 mm outline supports high-density PCB layouts while maintaining robust connectivity.
  • Commercial operating range: Rated 0 °C to 85 °C for standard commercial environments and applications.
  • RoHS compliant: Meets lead-free and hazardous substance requirements for streamlined manufacturing compliance.

Why Choose 5AGXMB3G6F31C6N?

The 5AGXMB3G6F31C6N Arria V GX FPGA balances large-scale programmable logic, meaningful on-chip memory, and a high I/O count in a compact FCBGA package, making it well suited for commercial designs that demand integration and flexibility. Its defined voltage and temperature specifications make it straightforward to specify into power and thermal budgets.

This device is a fit for teams targeting dense, reconfigurable digital implementations that benefit from substantial embedded resources and a high pin count in a surface-mount FPGA package.

If you would like pricing, lead-time, or a formal quote for the 5AGXMB3G6F31C6N, submit a request and our team will respond with procurement and technical details.

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