5AGXMB3G6F31C6G

The 5AGXMB3G6F31C6G is an Intel Arria V GX Field Programmable Gate Array supplied in a 896-BBGA (FCBGA) surface-mount package. This commercial-grade device delivers high logic capacity, substantial on-chip memory, and a dense I/O count suitable for designs that require integrated programmable logic in a compact BGA footprint.

Key on-device resources include 362,000 logic elements, approximately 19.8 Mbits of embedded RAM, and 384 user I/O pins. The device operates from a core voltage range of 1.07 V to 1.13 V and is specified for operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Logic Capacity — 362,000 logic elements to implement complex programmable logic and custom datapaths.
• Logic Array Blocks — 17,110 logic array blocks providing structured resources for logic synthesis and placement.
• Embedded Memory — Approximately 19.8 Mbits (19,822,592 bits) of on-chip RAM for buffering, state storage, and local data storage.
• I/O Resources — 384 I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Power — Core supply range: 1.07 V to 1.13 V for the FPGA core.
• Package & Mounting — 896-BBGA FCBGA (supplier package: 896-FBGA, 31×31), surface-mount for high-density PCB designs.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Use where large numbers of logic elements are required to implement complex control and processing functions.
• Memory-intensive designs — Leverage approximately 19.8 Mbits of embedded RAM for buffering, lookup tables, and local data storage to reduce external memory needs.
• I/O-dense platforms — Deploy in systems that require many parallel signals or multiple peripheral interfaces using 384 I/O pins.
• Compact BGA-based boards — Suitable for surface-mount designs that need a high-pin-count FPGA in a 31×31 896-FBGA footprint.

Unique Advantages

• High logic integration: 362,000 logic elements enable consolidation of complex logic and custom functions onto a single device.
• Substantial on-chip memory: Approximately 19.8 Mbits of embedded RAM reduce dependence on external memory for many use cases.
• Broad I/O capability: 384 I/O pins support wide parallel interfaces and multiple channel connections without immediate external multiplexing.
• Compact, manufacturable package: 896-BBGA FCBGA (896-FBGA, 31×31) surface-mount package supports high-density PCB implementations.
• Commercial temperature and compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream electronic products.

Why Choose 5AGXMB3G6F31C6G?

The 5AGXMB3G6F31C6G combines a large logic resource pool, considerable on-chip RAM, and a high I/O count in an industry-standard BGA package, making it well suited for designs that require integrated programmable logic with significant local memory and dense interfacing. As a commercial-grade Arria V GX device from Intel, it is documented within the Arria V device datasheet and specified for defined operating voltage and temperature ranges, enabling predictable integration into production designs.

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