5AGXMB3G4F40I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 19822592 362000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 240 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGXMB3G4F40I5G – Arria V GX FPGA, 362,000 logic elements, 1517-BBGA (FCBGA)
The 5AGXMB3G4F40I5G is an Intel Arria V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers high-density programmable logic with 362,000 logic elements and substantial on-chip memory, combined with a 704-pin I/O complement and an industrial temperature rating.
Designed for demanding embedded and industrial applications, the device provides a balanced set of programmable resources, I/O capability, and thermal/voltage operating ranges for robust system-level integration.
Key Features
- High-density programmable logic Offers 362,000 logic elements to implement complex logic, custom datapaths, and control functions.
- Embedded memory Contains approximately 19.8 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
- Extensive I/O Provides 704 I/O pins to support broad interfacing requirements and multiple parallel/serial buses.
- Industrial-grade operation Rated for operation from −40°C to 100°C to meet extended-temperature industrial environments.
- Core supply range Operates with a core voltage supply between 1.07 V and 1.13 V for defined power and timing behavior.
- Package & mounting Supplied in a 1517-BBGA (FCBGA) / 1517-FBGA, FC (40×40) package suitable for surface-mount assembly.
- Regulatory status RoHS compliant.
Typical Applications
- Industrial control and automation Use the device’s industrial temperature rating and large logic/memory resources for motor control, PLC functions, and complex sequencing tasks.
- High-density embedded processing Implement custom DSP pipelines, protocol offloads, and hardware accelerators using the high logic element count and embedded RAM.
- Communication and interface aggregation Leverage the 704 I/O pins for multi-protocol interfacing, bridging, and parallel data handling in communications equipment and infrastructure modules.
Unique Advantages
- Large programmable fabric: 362,000 logic elements provide the capacity to consolidate multiple functions into a single device and reduce external components.
- Significant on-chip memory: Approximately 19.8 Mbits of embedded RAM reduces reliance on external memory for many buffering and lookup needs, improving latency and system simplicity.
- High I/O density: 704 I/O pins enable flexible system partitioning and support for multiple interfaces without extensive external glue logic.
- Industrial thermal range: Rated from −40°C to 100°C for reliable operation in extended-temperature environments common in industrial deployments.
- Surface-mount package: 1517-BBGA/1517-FBGA (40×40) package supports high-density PCB designs and automated assembly.
- Standards-friendly compliance: RoHS compliance helps meet environmental regulatory requirements for manufactured products.
Why Choose 5AGXMB3G4F40I5G?
The 5AGXMB3G4F40I5G Arria V GX FPGA combines high logic density, ample embedded memory, and extensive I/O in a package and thermal envelope suited for industrial deployments. Its defined core voltage range and surface-mount BGA package make it appropriate for designs that require a compact, integrated programmable solution with predictable electrical and thermal characteristics.
This device is well suited for engineers and system designers looking to implement complex custom logic, interface aggregation, or embedded processing blocks where on-chip resources and industrial operating range are important selection criteria.
Request a quote or submit a pricing inquiry to evaluate 5AGXMB3G4F40I5G for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018