5AGXMB3G6F35C6N

The 5AGXMB3G6F35C6N is an Arria V GX family Field Programmable Gate Array (FPGA) from Intel, offered as a commercial-grade device. It provides a high-density programmable fabric with 362,000 logic elements, approximately 19.8 Mbits of embedded RAM, and 544 user I/O for designs requiring substantial on-chip logic, memory and I/O resources.

Packaged in a 1152-BBGA (1152-FBGA, 35×35) with exposed pad and intended for surface-mount assembly, this device targets applications that need dense integration and flexible I/O in a commercially rated temperature range.

Key Features

• Core Density  362,000 logic elements to implement substantial digital logic and complex state machines.
• Embedded Memory  Approximately 19.8 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capability  544 dedicated I/O pins to support high channel counts, parallel interfaces, and complex board-level connectivity.
• Power Supply  Specified supply range of 1.07 V to 1.13 V, providing defined operating conditions for the core.
• Package & Mounting  1152-BBGA package (supplier device package: 1152-FBGA, 35×35) with exposed pad; designed for surface-mount PCB assembly.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to suit standard commercial-environment applications.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Leverage the 362,000 logic elements and substantial embedded RAM for complex logic pipelines and data-path implementations.
• Multi-channel I/O aggregation  Use the 544 I/O pins to consolidate multiple interfaces or high-pin-count peripheral connections on a single device.
• Interface bridging and protocol conversion  Embedded logic and memory enable implementation of protocol conversion, buffering, and timing adaptation within commercial systems.

Unique Advantages

• High integration density: 362,000 logic elements and approximately 19.8 Mbits of embedded RAM reduce the need for external components and simplify board-level design.
• Extensive I/O resources: 544 I/O pins provide flexibility for complex interconnects and high-channel-count designs without multiple interface chips.
• Defined power envelope: Narrow core supply range (1.07 V–1.13 V) simplifies power-supply design and validation.
• Commercial grade: Rated for 0 °C to 85 °C operation to match standard commercial product environments.
• Surface-mount, exposed-pad package: 1152-BBGA (35×35) supports compact board layouts and effective thermal conduction through the exposed pad.
• RoHS compliant: Conforms to RoHS environmental requirements for regulatory-compliant product development.

Why Choose 5AGXMB3G6F35C6N?

The 5AGXMB3G6F35C6N Arria V GX FPGA combines a high logic element count, sizeable on-chip RAM, and a large I/O complement in a compact 1152-BBGA surface-mount package. As a commercial-grade Intel Arria V device, it is suitable for designs that demand extensive programmable logic, on-chip memory resources, and flexible interfacing in standard operating environments.

This device is a fit for engineers and teams building complex digital systems that benefit from dense integration and predictable electrical and thermal packaging characteristics. The combination of resource capacity and defined electrical/thermal specs supports scalable designs and streamlined BOM decisions.

Request a quote or submit a pricing inquiry to evaluate the 5AGXMB3G6F35C6N for your next FPGA-based design.