5AGXMB3G4F35I5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad

Quantity 399 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGA Exposed PadNumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs17110Number of Logic Elements/Cells362000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19822592

Overview of 5AGXMB3G4F35I5G – Arria V GX FPGA, 1152‑BBGA (Industrial)

The 5AGXMB3G4F35I5G is an Arria V GX Field Programmable Gate Array (FPGA) in an industrial-grade 1152‑BBGA FCBGA exposed pad package. This device delivers high logic capacity, substantial embedded RAM, and a large I/O count for complex, board‑level FPGA implementations.

Key electrical and environmental characteristics include a core supply range of 1.07 V to 1.13 V, an operating temperature range of −40 °C to 100 °C, surface‑mount packaging, and RoHS compliance.

Key Features

  • Logic Capacity — 362,000 logic elements for implementing large-scale digital designs and complex algorithms.
  • Embedded Memory — Approximately 19.8 Mbits of on‑chip RAM to support buffering, look‑up tables, and data storage without immediate external memory dependency.
  • I/O Resources — 544 I/O pins to connect multiple peripherals, interfaces, and board subsystems.
  • Package & Mounting — 1152‑BBGA FCBGA exposed pad package; supplier device package listed as 1152‑FBGA (35×35); surface mount mounting type.
  • Power — Core voltage supply specified from 1.07 V to 1.13 V.
  • Temperature Range — Industrial operating range from −40 °C to 100 °C.
  • Compliance — RoHS compliant.
  • Family — Part of the Arria V device family, which is documented in the Arria V device datasheet covering electrical characteristics, configuration specifications, and I/O timing.

Unique Advantages

  • High integration density: 362,000 logic elements allow consolidation of multiple functions into a single FPGA to reduce board-level component count.
  • On-chip memory capacity: Approximately 19.8 Mbits of RAM supports complex data paths and local buffering, reducing dependence on external memory.
  • Extensive I/O: 544 I/O pins enable broad interface integration and flexible system connectivity.
  • Industrial reliability: Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Compact, serviceable package: 1152‑BBGA FCBGA with exposed pad and 35×35 supplier footprint provides a compact form factor for high-density board layouts.
  • Standards-aware supply: RoHS compliance for environmental and manufacturing considerations.

Why Choose 5AGXMB3G4F35I5G?

The 5AGXMB3G4F35I5G positions itself as an industrial-grade Arria V GX FPGA offering a combination of high logic density, sizable embedded memory, and a large I/O complement in a surface-mount FCBGA package. Its defined core voltage window (1.07 V–1.13 V) and wide operating temperature range (−40 °C to 100 °C) make the device suitable for demanding board-level implementations that require deterministic electrical requirements and environmental robustness.

As a member of the Arria V family, this device is documented within the Arria V device datasheet covering electrical characteristics, configuration specifications, and I/O timing, enabling engineers to design and verify systems around clearly specified device behavior.

Request a quote or submit a sales inquiry for part number 5AGXMB3G4F35I5G to obtain pricing, availability, and lead‑time information.

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