5AGXMB3G4F35I5N

The 5AGXMB3G4F35I5N is an industrial-grade Arria V GX FPGA offering high logic density, abundant embedded memory, and extensive I/O capability in a compact surface-mount BGA package. It provides designers with a configurable hardware platform suited for demanding embedded and industrial systems.

Key device characteristics include approximately 362,000 logic elements, roughly 19.8 Mbits of on-chip RAM, 544 I/O pins, a core supply range of 1.07–1.13 V, and an operating temperature range of −40 °C to 100 °C, all in a 1152-BBGA exposed-pad package.

Key Features

• Core density – Approximately 362,000 logic elements and 17,110 logic array blocks as reported, enabling large-scale logic integration and complex custom architectures.
• Embedded memory – Approximately 19.8 Mbits of on-chip RAM to support buffering, state storage, and memory-hungry logic functions without external memory in many designs.
• Extensive I/O – 544 available I/O pins to support broad peripheral connectivity and parallel interfacing requirements.
• Precision power envelope – Core supply range of 1.07 V to 1.13 V for predictable power planning and supply design.
• Industrial temperature rating – Rated for −40 °C to 100 °C operation, suitable for a wide range of industrial environments.
• Package & mounting – 1152-BBGA, FCBGA exposed pad with supplier package listed as 1152-FBGA (35×35); designed for surface-mount PCB assembly.
• Regulatory compliance – RoHS compliant.

Typical Applications

• Industrial control and automation – Leverage the industrial temperature grade and wide I/O count for programmable logic in factory systems and process control.
• High-density embedded processing – Use the large logic element count and on-chip RAM for compute-intensive embedded workloads and custom datapath implementations.
• Communications and networking – Extensive I/O resources and large logic/memory capacity support complex interfacing and protocol handling in networking equipment.
• Prototyping and system integration – A resource-rich FPGA platform for validating system architectures and integrating multiple digital functions into a single device.

Unique Advantages

• High logic capacity: Approximately 362k logic elements provide headroom for large, multi-function designs without immediate device upgrades.
• Substantial on-chip memory: Nearly 19.8 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage needs, simplifying BOM and PCB routing.
• Large I/O complement: 544 I/O pins enable wide parallel interfaces and high connectivity density for complex systems.
• Industrial reliability: Specified operation from −40 °C to 100 °C suits extended-range deployments and harsh industrial environments.
• Compact BGA package: 1152-BBGA exposed-pad packaging provides a space-efficient footprint for high-density board layouts and thermal management.
• RoHS compliance: Conforms to RoHS requirements for environmental and manufacturing considerations.

Why Choose 5AGXMB3G4F35I5N?

The 5AGXMB3G4F35I5N positions itself as a high-capacity, industrial-grade FPGA option for engineers needing significant logic resources, on-chip memory, and broad I/O in a compact surface-mount package. Its electrical and thermal characteristics support robust embedded and industrial system designs where integration density and predictable power/temperature behavior matter.

This device is suitable for teams developing complex programmable hardware solutions that require scalable logic and memory, extensive interfacing, and industry-oriented operating range, while maintaining compliance with RoHS manufacturing standards.

Request a quote or submit a sales inquiry to evaluate 5AGXMB3G4F35I5N for your next design and to obtain availability and pricing information.