5AGXMB1G6F35C6G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 17358848 300000 1152-BBGA, FCBGA

Quantity 91 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXMB1G6F35C6G – Arria V GX FPGA, 300,000 Logic Elements, 1152‑BBGA

The 5AGXMB1G6F35C6G is an Intel Arria V GX field programmable gate array (FPGA) provided in a 1152‑BBGA, FCBGA package. It delivers a high logic capacity and substantial on‑chip memory with a large I/O count in a surface‑mount form factor, targeted at commercial‑grade systems.

Key hardware attributes include 300,000 logic elements (14,151 CLBs), approximately 17.36 Mbits of embedded memory, 544 I/Os, and a specified core supply range of 1.07 V to 1.13 V with an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  300,000 logic elements driven by 14,151 CLBs to implement complex programmable logic and control functions.
  • Embedded Memory  Approximately 17.36 Mbits of on‑chip RAM to support buffering, data storage, and local processing needs.
  • High I/O Count  544 I/O pins for extensive peripheral, bus, and multi‑lane interfacing without external multiplexing.
  • Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA, FC (35×35); surface‑mount for compact board integration.
  • Power and Operating Range  Core voltage supply specified from 1.07 V to 1.13 V and commercial operating temperature of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • High‑density digital processing  Implement complex logic functions and custom datapaths using the device's large logic element count and embedded RAM.
  • Interface aggregation  Aggregate and bridge multiple parallel or serial interfaces leveraging the device's 544 I/Os for direct connectivity.
  • Prototyping and system integration  Use as a programmable integration hub for validating hardware architectures and consolidating discrete logic.

Unique Advantages

  • High logic density: 300,000 logic elements enable large, integrated designs without immediate partitioning across multiple devices.
  • Substantial on‑chip RAM: Approximately 17.36 Mbits of embedded memory reduces reliance on external memory for buffering and local storage.
  • Extensive I/O capability: 544 I/Os provide flexibility for wide buses, multiple peripherals, or high‑pin‑count interfaces.
  • Compact, high‑pin package: 1152‑BBGA (supplier: 1152‑FBGA, FC 35×35) delivers high pin density in a compact surface‑mount footprint.
  • Commercial grade and RoHS compliant: Specified operating range of 0 °C to 85 °C and RoHS compliance support mainstream commercial deployments.

Why Choose 5AGXMB1G6F35C6G?

The 5AGXMB1G6F35C6G Arria V GX FPGA balances high programmable logic capacity, meaningful on‑chip memory, and a large I/O complement in a compact surface‑mount BBGA package. It is well suited to commercial designs that require consolidated logic, extensive interfacing, and embedded memory to minimize external components.

Engineers targeting scalable, programmable hardware platforms will find this device appropriate for complex integration tasks, prototyping, and commercial deployments that fit within the specified voltage and temperature ranges.

Request a quote or submit an inquiry to receive pricing and availability details for the 5AGXMB1G6F35C6G Arria V GX FPGA.

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