5AGXMB1G4F31C4N

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 17358848 300000 896-BBGA, FCBGA

Quantity 1,537 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs14151Number of Logic Elements/Cells300000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17358848

Overview of 5AGXMB1G4F31C4N – Arria V GX Field Programmable Gate Array (FPGA) IC

The 5AGXMB1G4F31C4N is an Arria V GX FPGA from Intel designed for high-density, I/O-rich digital designs. With 300,000 logic elements and a broad I/O count, this commercial-grade device supports complex system integration where on-chip logic capacity, embedded memory, and robust packaging are primary requirements.

Engineered for applications that demand large programmable logic fabrics and significant embedded memory, the device delivers a balance of capacity and integration while operating within a narrow core voltage window (1.07 V–1.13 V) and a commercial temperature range (0 °C–85 °C).

Key Features

  • Logic Capacity — 300,000 logic elements to implement large-scale digital functions and complex state machines.
  • Embedded Memory — Approximately 17.4 Mbits of on-chip RAM for buffering, scratch storage, and memory-intensive logic.
  • I/O Resources — 384 user I/O pins to support extensive external interfaces and parallel connectivity.
  • Power and Core Voltage — Core supply range of 1.07 V to 1.13 V for stable operation within specified electrical limits.
  • Package and Mounting — 896-ball BGA package (896-BBGA, FCBGA) with supplier package dimensions 31 × 31 mm; surface-mount mounting type for board-level integration.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Compliance — RoHS-compliant manufacturing to support modern regulatory and assembly requirements.
  • Documented Performance — Device-level electrical and switching characteristics are covered in the Arria V device datasheet for detailed design guidance.

Typical Applications

  • High-density digital processing — Implement complex logic, control engines, and custom datapaths using large logic capacity and embedded RAM.
  • I/O-intensive interfaces — Support boards and modules that require many parallel or mixed-signal interfaces with 384 I/O pins.
  • System integration and prototyping — Integrate multiple functions into a single programmable device for proofs-of-concept and system-level validation.
  • Embedded acceleration — Offload compute-intensive logic into the FPGA fabric using the device’s significant logic and memory resources.

Unique Advantages

  • Large programmable fabric: 300,000 logic elements provide the headroom to implement extensive custom logic and parallel processing blocks.
  • Substantial on-chip memory: Approximately 17.4 Mbits of RAM reduces dependence on external memory for many buffering and state-storage tasks.
  • High I/O density: 384 I/Os enable complex peripheral interfacing and support multiple simultaneous external connections.
  • Board-level readiness: 896-ball FCBGA package and surface-mount mounting simplify PCB layout for high-density assemblies.
  • Commercial operating range: Rated 0 °C–85 °C and RoHS-compliant, suitable for mainstream electronics and embedded systems.
  • Tightly specified core voltage: 1.07 V–1.13 V operating window aids predictable power delivery and thermal planning.

Why Choose 5AGXMB1G4F31C4N?

The 5AGXMB1G4F31C4N Arria V GX FPGA combines a large logic fabric, significant embedded memory, and a high I/O count in a commercial-grade, RoHS-compliant BGA package. It is well suited to designs that require dense programmable logic, substantial on-chip buffering, and broad external interfacing while maintaining a clear electrical and thermal envelope defined by the datasheet.

This device fits design teams and procurement groups seeking scalable FPGA capacity with documented device characteristics for system-level integration and reliable production assembly.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5AGXMB1G4F31C4N.

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