5AGXMA7G6F31C6N

The 5AGXMA7G6F31C6N is an Intel Arria V GX field programmable gate array (FPGA) in a 896‑FBGA (31×31) package optimized for commercial applications. It provides a high-capacity programmable logic fabric with extensive on-chip memory and a large I/O count for complex, reconfigurable designs.

This device targets commercial embedded designs that require significant logic density, substantial embedded RAM, and wide I/O connectivity while operating within a 0 °C to 85 °C temperature range and a core voltage of 1.07 V to 1.13 V.

Key Features

• Logic Capacity — 242,000 logic elements and 11,460 logic blocks, enabling substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 15.47 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density — 384 user I/Os to support high pin-count interfaces and multiple peripheral connections.
• Package & Mounting — Supplied in a 896‑FBGA (31×31) package case (896‑BBGA, FCBGA) and designed for surface-mount assembly.
• Power and Thermal — Core supply voltage range of 1.07 V to 1.13 V and an operating temperature range of 0 °C to 85 °C, suitable for commercial-grade environments.
• Compliance — RoHS‑compliant device meeting environmental regulatory expectations for lead-free assembly.

Typical Applications

• Commercial embedded systems — Programmable logic and substantial on‑chip memory support a wide range of reconfigurable control and processing tasks.
• High‑I/O interface designs — Large I/O count enables aggregation of multiple external interfaces and peripherals.
• Data buffering and local processing — Embedded RAM capacity supports packet buffering, FIFO implementations, and localized data handling.

Unique Advantages

• High logic density: 242,000 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators.
• Significant embedded memory: Approximately 15.47 Mbits of RAM reduces external memory dependency and lowers system BOM for many buffering and caching tasks.
• Extensive connectivity: 384 I/Os deliver flexible external interfacing options for multi‑channel and high‑pin-count designs.
• Compact, production-friendly package: 896‑FBGA (31×31) offers a dense footprint for space-constrained PCBs while supporting surface-mount assembly processes.
• Commercial temperature rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS compliant: Meets lead‑free environmental requirements for modern electronics manufacturing.

Why Choose 5AGXMA7G6F31C6N?

The 5AGXMA7G6F31C6N combines substantial programmable logic, significant embedded RAM, and a high I/O count in a compact 896‑FBGA package, making it well suited for commercial designs that require reconfigurability and on‑chip resources. As a member of the Intel Arria V family, it aligns with device families designed for scalable FPGA solutions across a range of densities.

Choose this device when your design demands a balance of logic capacity, memory, and I/O density within a commercial temperature profile and standard surface‑mount packaging.

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