5AGXMA7G4F31I5NAB

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA

Quantity 1,076 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11460Number of Logic Elements/Cells242000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits15470592

Overview of 5AGXMA7G4F31I5NAB – Arria V GX Field Programmable Gate Array (FPGA), 896-BBGA FCBGA

The 5AGXMA7G4F31I5NAB is an Intel Arria V GX FPGA offered in an industrial grade package. It provides high logic capacity, substantial on‑chip memory, and a large I/O complement in a high‑pin‑count FCBGA package suitable for dense, performance‑oriented FPGA designs.

With approximately 242,000 logic elements, roughly 15.47 Mbits of embedded memory and 384 I/Os, this device is built to handle complex digital designs that require significant logic resources, memory bandwidth and extensive external connectivity while operating across an industrial temperature range.

Key Features

  • Logic Capacity — Approximately 242,000 logic elements to implement complex state machines, datapaths and custom accelerators.
  • Embedded Memory — Approximately 15.47 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage.
  • I/O Density — 384 general-purpose I/O pins for broad connectivity to peripherals, memory interfaces and system signals.
  • Package — 896‑BBGA (FCBGA) package; supplier device package listed as 896‑FBGA (31×31) for high pin count surface‑mount implementations.
  • Power — Core voltage supply range 1.07 V to 1.13 V for defined power design and regulation.
  • Industrial Grade & Temperature — Rated industrial grade with operating temperature range −40°C to 100°C for deployment in rugged environments.
  • Mounting — Surface mount device for PCB assembly and compact board layouts.
  • Compliance — RoHS compliant.

Typical Applications

  • High‑density digital processing — Implement complex logic blocks and data paths using the large logic element count and on‑chip RAM.
  • System integration and bridging — Use the extensive I/O to connect multiple subsystems, interfaces and external memory.
  • Industrial control and automation — Industrial temperature rating and robust packaging support deployment in demanding environments.
  • Prototype and development platforms — Leverage the device’s resources to evaluate system architectures and accelerate time‑to‑prototype.

Unique Advantages

  • High logic density: Approximately 242,000 logic elements enable implementation of large, complex designs on a single device.
  • Significant embedded memory: Approximately 15.47 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and caching tasks.
  • Extensive I/O: 384 I/Os provide flexibility for multi‑channel interfaces, parallel buses and mixed‑signal connectivity.
  • Industrial temperature capability: Rated for −40°C to 100°C operation to meet environmental robustness requirements.
  • Compact, high‑pin‑count package: 896‑BBGA (FCBGA) / supplier 896‑FBGA (31×31) enables dense board layouts while supporting many signals.
  • Controlled core supply range: 1.07 V to 1.13 V core supply window assists predictable power design and regulation.

Why Choose 5AGXMA7G4F31I5NAB?

The 5AGXMA7G4F31I5NAB Arria V GX FPGA combines high logic capacity, substantial embedded memory and a broad I/O count in a single industrial‑grade FCBGA package. These characteristics make it a practical choice for designs that require consolidated digital processing, complex interfacing and reliable operation across a wide temperature range.

Designed and manufactured by Intel, this device offers a defined power envelope and packaging suited for engineers looking to scale logic‑intensive designs while maintaining board‑level density and environmental robustness.

Request a quote or submit an inquiry to obtain pricing and availability for 5AGXMA7G4F31I5NAB.

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