5AGXMA7G4F31I5NAB
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 15470592 242000 896-BBGA, FCBGA |
|---|---|
| Quantity | 1,076 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11460 | Number of Logic Elements/Cells | 242000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 15470592 |
Overview of 5AGXMA7G4F31I5NAB – Arria V GX Field Programmable Gate Array (FPGA), 896-BBGA FCBGA
The 5AGXMA7G4F31I5NAB is an Intel Arria V GX FPGA offered in an industrial grade package. It provides high logic capacity, substantial on‑chip memory, and a large I/O complement in a high‑pin‑count FCBGA package suitable for dense, performance‑oriented FPGA designs.
With approximately 242,000 logic elements, roughly 15.47 Mbits of embedded memory and 384 I/Os, this device is built to handle complex digital designs that require significant logic resources, memory bandwidth and extensive external connectivity while operating across an industrial temperature range.
Key Features
- Logic Capacity — Approximately 242,000 logic elements to implement complex state machines, datapaths and custom accelerators.
- Embedded Memory — Approximately 15.47 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage.
- I/O Density — 384 general-purpose I/O pins for broad connectivity to peripherals, memory interfaces and system signals.
- Package — 896‑BBGA (FCBGA) package; supplier device package listed as 896‑FBGA (31×31) for high pin count surface‑mount implementations.
- Power — Core voltage supply range 1.07 V to 1.13 V for defined power design and regulation.
- Industrial Grade & Temperature — Rated industrial grade with operating temperature range −40°C to 100°C for deployment in rugged environments.
- Mounting — Surface mount device for PCB assembly and compact board layouts.
- Compliance — RoHS compliant.
Typical Applications
- High‑density digital processing — Implement complex logic blocks and data paths using the large logic element count and on‑chip RAM.
- System integration and bridging — Use the extensive I/O to connect multiple subsystems, interfaces and external memory.
- Industrial control and automation — Industrial temperature rating and robust packaging support deployment in demanding environments.
- Prototype and development platforms — Leverage the device’s resources to evaluate system architectures and accelerate time‑to‑prototype.
Unique Advantages
- High logic density: Approximately 242,000 logic elements enable implementation of large, complex designs on a single device.
- Significant embedded memory: Approximately 15.47 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and caching tasks.
- Extensive I/O: 384 I/Os provide flexibility for multi‑channel interfaces, parallel buses and mixed‑signal connectivity.
- Industrial temperature capability: Rated for −40°C to 100°C operation to meet environmental robustness requirements.
- Compact, high‑pin‑count package: 896‑BBGA (FCBGA) / supplier 896‑FBGA (31×31) enables dense board layouts while supporting many signals.
- Controlled core supply range: 1.07 V to 1.13 V core supply window assists predictable power design and regulation.
Why Choose 5AGXMA7G4F31I5NAB?
The 5AGXMA7G4F31I5NAB Arria V GX FPGA combines high logic capacity, substantial embedded memory and a broad I/O count in a single industrial‑grade FCBGA package. These characteristics make it a practical choice for designs that require consolidated digital processing, complex interfacing and reliable operation across a wide temperature range.
Designed and manufactured by Intel, this device offers a defined power envelope and packaging suited for engineers looking to scale logic‑intensive designs while maintaining board‑level density and environmental robustness.
Request a quote or submit an inquiry to obtain pricing and availability for 5AGXMA7G4F31I5NAB.

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