5AGXMA7G4F31I5N

The 5AGXMA7G4F31I5N is an Intel Arria V GX field programmable gate array (FPGA) offered in an industrial grade. It integrates a high density of programmable logic and on-chip memory alongside a broad I/O complement in a compact ball-grid array package. The device is specified with clearly defined core voltage and temperature operating ranges for industrial applications.

Key Features

• Logic Capacity  Approximately 242,000 logic elements to support complex programmable logic implementations.
• Embedded Memory  Approximately 15.47 Mbits of on-chip RAM for buffering, state storage, and data processing functions.
• I/O  384 user I/O pins to accommodate wide peripheral and bus interfacing requirements.
• Power Supply  Core voltage supply range specified at 1.07 V to 1.13 V to match system power budgets and design margins.
• Package & Mounting  Available in an 896-ball FBGA package (896-FBGA (31x31)) / 896-BBGA, FCBGA; designed for surface-mount assembly.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Standards Compliance  RoHS compliant.

Unique Advantages

• High logic density: The device’s ~242,000 logic elements enable substantial FPGA-based system integration and complexity within a single chip.
• Significant on-chip memory: Approximately 15.47 Mbits of embedded RAM reduces external memory needs for many buffering and stateful functions.
• Extensive I/O: 384 I/Os provide flexibility for interfacing multiple peripherals, busses, and custom I/O schemes without immediate external multiplexing.
• Industrial temperature support: Rated operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact surface-mount package: The 896-FBGA (31x31) package offers a dense, board-level footprint for space-constrained system designs.
• Clear power specification: A defined core supply window (1.07 V–1.13 V) simplifies power-supply selection and validation.

Why Choose 5AGXMA7G4F31I5N?

This Arria V GX FPGA part combines a large programmable logic fabric, substantial embedded memory, and broad I/O in an industrial-grade, surface-mount FBGA package. The device is suitable for designs that require high logic capacity and embedded RAM while maintaining a compact board footprint and predictable thermal and power envelopes.

Engineers and procurement teams can rely on the device’s explicit electrical and environmental specifications—such as core voltage and temperature range—to plan system power delivery and thermal management. The combination of logic, memory, and I/O density makes the 5AGXMA7G4F31I5N a practical choice for complex FPGA-based designs that require a single-chip solution.

If you would like pricing, availability, or quotes for volume and board-level procurement, request a quote or submit an inquiry specifying the 5AGXMA7G4F31I5N part number. Refer to the device datasheet for complete electrical, timing, and configuration specifications.