5AGXMA7D4F27I3N

The 5AGXMA7D4F27I3N is an Intel Arria V GX field programmable gate array (FPGA) supplied in a 672-ball BGA package. This industrial-grade device integrates high-density programmable logic, on-chip memory, and a substantial I/O complement to address demanding embedded and industrial applications.

With approximately 242,000 logic elements, roughly 15.47 Mbits of embedded RAM, and 336 I/Os, this FPGA balances large logic capacity and memory with a robust operating envelope (–40 °C to 100 °C) and low core-voltage operation (1.12 V to 1.18 V).

Key Features

• Core Logic Density — Approximately 242,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory — Approximately 15.47 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Resources — 336 general-purpose I/O pins to support wide parallel interfaces and board-level connectivity.
• Power and Voltage — Core supply range between 1.12 V and 1.18 V to match system power rails and design constraints.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 672-ball BGA (FCBGA); supplier device package listed as 672‑FBGA (27×27); surface-mount mount type for compact board integration.
• Compliance — RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature support and high logic density enable implementation of control logic, sequencing, and custom processing functions.
• High-Density Programmable Logic — Large count of logic elements and embedded memory support complex state machines, algorithm acceleration, and custom datapaths.
• I/O-Intensive Designs — Up to 336 I/Os accommodate extensive parallel interfaces, sensor arrays, or board-level peripheral connectivity.

Unique Advantages

• High Logic and Memory Capacity: Approximately 242,000 logic elements combined with ~15.47 Mbits of embedded RAM lets you consolidate functionality that would otherwise require multiple devices.
• Broad I/O Complement: 336 I/Os provide flexibility for multi-channel interfaces and dense board-level interconnects.
• Industrial Reliability: Rated operation from –40 °C to 100 °C supports reliable use in industrial environments and temperature-stressed applications.
• Compact Surface-Mount Package: 672-ball BGA (27×27) format enables high-density PCB layouts while retaining strong thermal and mechanical characteristics.
• Low-Voltage Core Operation: Narrow core voltage range (1.12 V–1.18 V) simplifies power-supply design for the FPGA core domain.
• RoHS Compliant: Meets lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose 5AGXMA7D4F27I3N?

The 5AGXMA7D4F27I3N offers a balanced combination of high logic density, embedded memory, and extensive I/O in an industrial-grade Arria V GX FPGA. It is well suited to engineers and system designers who need programmable capacity and flexibility within a temperature-tolerant, surface-mount package backed by Intel’s Arria V device family documentation and support.

Choose this part when your design requires consolidated programmable logic, substantial on-chip RAM, and a large I/O footprint in a compact BGA package for long-lived industrial applications.

Request a quote or submit an inquiry to receive pricing and availability for the 5AGXMA7D4F27I3N.