5AGXMA5G6F35C6N

The 5AGXMA5G6F35C6N is an Intel Arria V GX field programmable gate array supplied in a 1152‑FBGA (35×35) package with an exposed pad. It delivers high logic density and significant on‑chip memory, together with a large I/O count for complex, I/O‑intensive designs. Typical use cases include systems that require extensive programmable logic, substantial embedded memory, and many external interfaces while operating within commercial temperature and voltage ranges.

Key Features

• Logic Density  Provides 190,000 logic elements suitable for complex FPGA designs and high‑capacity logic implementations.
• Embedded Memory  Approximately 12.7 Mbits (13,284,352 bits) of on‑chip RAM to support buffering, packet processing, and data‑path storage.
• High I/O Count  544 user I/O pins to support multiple parallel interfaces, wide buses, and multi‑lane connectivity.
• Voltage and Power  Core supply range from 1.07 V to 1.13 V to match system power rails and design requirements.
• Package & Mounting  1152‑BBGA / 1152‑FBGA (35×35) with exposed pad, surface‑mount package for compact, high‑density board designs.
• Commercial Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation for mainstream embedded and communications equipment.
• Regulatory Status  RoHS compliant.

Typical Applications

• High‑density programmable logic  Large designs that require substantial logic resources and embedded memory for custom accelerators or control logic.
• Data‑path and buffering  Applications that need on‑chip RAM for packet buffering, FIFOs, or temporary data storage paired with significant logic capacity.
• I/O‑intensive systems  Systems requiring many external interfaces—sensor arrays, multi‑lane buses, or bridging functions—benefit from the 544 available I/O pins.
• Compact board designs  Surface‑mount 1152‑FBGA packaging with an exposed pad supports space‑constrained implementations while maintaining thermal interface options.

Unique Advantages

• Substantial logic resources: 190,000 logic elements enable implementation of large state machines, datapaths, and custom processing blocks within a single FPGA.
• Generous embedded memory: Approximately 12.7 Mbits of on‑chip RAM reduces the need for external memory for many buffering and scratchpad requirements.
• High external connectivity: 544 I/O pins provide flexibility for parallel interfaces, multi‑bus systems, and complex peripheral connectivity without multiple devices.
• Compact, manufacturable package: 1152‑FBGA (35×35) surface‑mount package with exposed pad supports high‑density PCB layouts and thermal management strategies.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream embedded product deployments.

Why Choose 5AGXMA5G6F35C6N?

The 5AGXMA5G6F35C6N Arria V GX FPGA is positioned for designs that demand a balance of high logic density, significant embedded memory, and extensive I/O in a compact surface‑mount package. Its electrical and packaging characteristics make it suitable for commercial embedded systems, communications equipment, and other applications that fit within the stated operating voltage and temperature ranges.

Choosing this device supports scalable designs that consolidate functions onto a single programmable device, reducing parts count and simplifying system architecture while maintaining compliance with RoHS requirements.

Request a quote or submit a parts inquiry to get pricing and availability for the 5AGXMA5G6F35C6N Arria V GX FPGA. Include your desired quantity and delivery timeframe to receive a prompt response.