5AGXMA5G6F31C6N
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 384 13284352 190000 896-BBGA, FCBGA |
|---|---|
| Quantity | 560 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BBGA, FCBGA | Number of I/O | 384 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8962 | Number of Logic Elements/Cells | 190000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13284352 |
Overview of 5AGXMA5G6F31C6N – Arria V GX Field Programmable Gate Array (FPGA), 190,000 logic elements, 384 I/O
The 5AGXMA5G6F31C6N is an Arria V GX Field Programmable Gate Array (FPGA) in a 896-ball BGA (FCBGA) package from Intel. This high-density programmable device combines a large pool of logic resources, significant on-chip memory, and a high I/O count for designs that require flexible digital logic implementation and heavy I/O interfacing.
With 190,000 logic elements and 384 I/O pins, the device addresses applications that need substantial programmable logic capacity and abundant connectivity, while operating within a commercial temperature range and typical core supply window.
Key Features
- Logic Capacity — 190,000 logic elements providing substantial resources for complex custom logic and algorithm implementation; the device also includes 8,962 CLBs for block-level logic structuring.
- Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support buffering, local data storage, and embedded processing tasks.
- I/O Density — 384 I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count peripheral integration.
- Power and Core Supply — Core voltage supply range specified at 1.07 V to 1.13 V for predictable power domain planning.
- Package and Mounting — 896-ball BGA (FCBGA) footprint, supplier package 896-FBGA (31×31), surface-mount mounting for compact board-level integration.
- Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Custom digital processing — Leverage the 190,000 logic elements and embedded memory for bespoke signal-processing blocks, control logic, or protocol implementations.
- High-density I/O interfacing — Use the 384 I/O pins for applications requiring extensive peripheral connectivity or wide parallel data paths.
- On-chip buffering and local storage — Approximately 13.3 Mbits of RAM supports data buffering, FIFO structures, and small embedded memories close to logic functions.
Unique Advantages
- Substantial programmable logic — 190,000 logic elements enable implementation of large custom logic designs without immediate need for multiple devices.
- Comprehensive I/O — 384 I/O pins reduce the need for external multiplexing and simplify board-level signal routing for multi-channel systems.
- Significant embedded memory — Approximately 13.3 Mbits of on-chip RAM supports local data handling and performance-sensitive buffering.
- Compact, surface-mount packaging — 896-ball FCBGA (31×31) form factor allows high-density PCB layouts while maintaining a robust package footprint.
- Predictable core supply range — Defined core voltage window (1.07 V to 1.13 V) helps simplify power-supply design and validation.
- Regulatory compliance — RoHS compliance supports environmentally conscious manufacturing and procurement.
Why Choose 5AGXMA5G6F31C6N?
The 5AGXMA5G6F31C6N Arria V GX FPGA delivers a balanced combination of high logic density, sizable embedded memory, and extensive I/O in a compact 896-ball FCBGA package. Its commercial-grade operating range and clearly defined core-voltage window make it suitable for demanding board-level designs that require predictable electrical and thermal behavior.
This device is well suited for engineering teams designing complex, programmable digital systems that need substantial on-chip resources and high pin count without adding additional devices, enabling tighter integration and streamlined BOMs.
Request a quote or submit a quote for part number 5AGXMA5G6F31C6N to receive pricing and availability information tailored to your project requirements.

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