5AGXMA5G6F31C6N

IC FPGA 384 I/O 896FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 384 13284352 190000 896-BBGA, FCBGA

Quantity 560 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BBGA, FCBGANumber of I/O384Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXMA5G6F31C6N – Arria V GX Field Programmable Gate Array (FPGA), 190,000 logic elements, 384 I/O

The 5AGXMA5G6F31C6N is an Arria V GX Field Programmable Gate Array (FPGA) in a 896-ball BGA (FCBGA) package from Intel. This high-density programmable device combines a large pool of logic resources, significant on-chip memory, and a high I/O count for designs that require flexible digital logic implementation and heavy I/O interfacing.

With 190,000 logic elements and 384 I/O pins, the device addresses applications that need substantial programmable logic capacity and abundant connectivity, while operating within a commercial temperature range and typical core supply window.

Key Features

  • Logic Capacity — 190,000 logic elements providing substantial resources for complex custom logic and algorithm implementation; the device also includes 8,962 CLBs for block-level logic structuring.
  • Embedded Memory — Approximately 13.3 Mbits of on-chip RAM to support buffering, local data storage, and embedded processing tasks.
  • I/O Density — 384 I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count peripheral integration.
  • Power and Core Supply — Core voltage supply range specified at 1.07 V to 1.13 V for predictable power domain planning.
  • Package and Mounting — 896-ball BGA (FCBGA) footprint, supplier package 896-FBGA (31×31), surface-mount mounting for compact board-level integration.
  • Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Custom digital processing — Leverage the 190,000 logic elements and embedded memory for bespoke signal-processing blocks, control logic, or protocol implementations.
  • High-density I/O interfacing — Use the 384 I/O pins for applications requiring extensive peripheral connectivity or wide parallel data paths.
  • On-chip buffering and local storage — Approximately 13.3 Mbits of RAM supports data buffering, FIFO structures, and small embedded memories close to logic functions.

Unique Advantages

  • Substantial programmable logic — 190,000 logic elements enable implementation of large custom logic designs without immediate need for multiple devices.
  • Comprehensive I/O — 384 I/O pins reduce the need for external multiplexing and simplify board-level signal routing for multi-channel systems.
  • Significant embedded memory — Approximately 13.3 Mbits of on-chip RAM supports local data handling and performance-sensitive buffering.
  • Compact, surface-mount packaging — 896-ball FCBGA (31×31) form factor allows high-density PCB layouts while maintaining a robust package footprint.
  • Predictable core supply range — Defined core voltage window (1.07 V to 1.13 V) helps simplify power-supply design and validation.
  • Regulatory compliance — RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose 5AGXMA5G6F31C6N?

The 5AGXMA5G6F31C6N Arria V GX FPGA delivers a balanced combination of high logic density, sizable embedded memory, and extensive I/O in a compact 896-ball FCBGA package. Its commercial-grade operating range and clearly defined core-voltage window make it suitable for demanding board-level designs that require predictable electrical and thermal behavior.

This device is well suited for engineering teams designing complex, programmable digital systems that need substantial on-chip resources and high pin count without adding additional devices, enabling tighter integration and streamlined BOMs.

Request a quote or submit a quote for part number 5AGXMA5G6F31C6N to receive pricing and availability information tailored to your project requirements.

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