5AGXMB5G4F40I5

IC FPGA 704 I/O 1517FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 704 23625728 420000 1517-BBGA

Quantity 625 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGANumber of I/O704Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs19811Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits23625728

Overview of 5AGXMB5G4F40I5 – Arria V GX FPGA, 704 I/Os, ~420,000 Logic Elements

The 5AGXMB5G4F40I5 is an Intel Arria V GX field programmable gate array packaged in a 1517‑FBGA (40×40) surface‑mount package. It provides a high logic‑capacity FPGA fabric with substantial embedded RAM and a large I/O count targeted at industrial‑grade designs.

With approximately 420,000 logic elements, roughly 23.6 Mbits of on‑chip RAM, a 704‑pin I/O capability, and an industrial operating range of −40 °C to 100 °C, this device is suited to applications that require dense logic, abundant on‑chip memory, and wide temperature operation. The device operates from a core supply in the 1.07 V to 1.13 V range and is RoHS compliant.

Key Features

  • Core Logic: Approximately 420,000 logic elements for complex, high‑density digital designs.
  • Embedded Memory: Approximately 23.6 Mbits of total RAM bits to support memory‑intensive functions without external RAM.
  • I/O Capacity: 704 available I/Os to interface with multiple peripherals, buses, and high‑pin‑count systems.
  • Package & Mounting: 1517‑FBGA (40×40) package in a surface‑mount form factor for compact board integration.
  • Power Supply: Core voltage supply specified between 1.07 V and 1.13 V to match system power delivery requirements.
  • Industrial Grade & Temperature Range: Industrial grade device rated for operation from −40 °C to 100 °C for robust environmental performance.
  • Standards Compliance: RoHS compliant to support environmentally regulated designs.
  • Documentation: Supported by the Arria V device datasheet covering electrical characteristics, switching characteristics, configuration specifications, and I/O timing for detailed design reference.

Typical Applications

  • High‑density logic systems: Designs that require large programmable logic capacity and complex custom logic implementations.
  • Memory‑intensive processing: Embedded algorithms and data buffering that benefit from approximately 23.6 Mbits of on‑chip RAM.
  • High‑pin‑count interfaces: Systems needing extensive parallel or multi‑interface connectivity leveraging 704 I/Os.

Unique Advantages

  • Substantial logic capacity: Approximately 420,000 logic elements enable consolidation of large digital functions into a single device, reducing board count.
  • Integrated on‑chip memory: Nearly 23.6 Mbits of RAM reduces reliance on external memory, simplifying BOM and board routing.
  • Large I/O complement: 704 I/Os provide flexibility for multi‑interface designs, additional sensors, or high‑channel count systems.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally demanding environments.
  • Compact FBGA package: 1517‑FBGA (40×40) surface‑mount package supports dense PCB layouts while maintaining robust connectivity.
  • Regulatory compliance: RoHS compliance aligns with environmental requirements and simplifies regulatory management.

Why Choose 5AGXMB5G4F40I5?

The 5AGXMB5G4F40I5 Arria V GX FPGA combines high logic density, significant embedded RAM, and a large I/O count in an industrial‑rated, surface‑mount FBGA package. Its electrical and configuration characteristics are documented within the Arria V device datasheet to assist in detailed system design and validation.

This device is appropriate for engineering teams designing systems that need to integrate complex digital logic, buffer substantial on‑chip data, and support many external interfaces while meeting industrial temperature requirements. Its combination of capacity, packaging, and documented device specifications supports scalable, robust product development.

If you would like pricing, lead‑time, or availability information for the 5AGXMB5G4F40I5, request a quote or submit your inquiry and our team will respond promptly.

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