5AGXMB5G4F40I5G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 704 23625728 420000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,055 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 704 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158491 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23625728 |
Overview of 5AGXMB5G4F40I5G – Arria V GX Field Programmable Gate Array (FPGA)
The 5AGXMB5G4F40I5G is an Intel Arria V GX Field Programmable Gate Array (FPGA) offered in an industrial grade. It integrates a large programmable fabric, substantial on-chip RAM, and a high I/O count in a 1517‑FBGA (40×40) package for surface‑mount assembly.
This device is suited to designs that require high logic density, significant embedded memory, and robust operating range, with a tight core voltage supply window (1.07 V to 1.13 V) and an operating temperature range of −40 °C to 100 °C.
Key Features
- High Logic Capacity — Approximately 420,000 logic elements to support complex programmable logic and large-scale integration.
- Embedded Memory — Approximately 23.6 Mbits of on‑chip RAM for buffering, scratchpad storage, and algorithm acceleration.
- Extensive I/O — 704 user I/O pins to interface with wide external peripherals and high‑pin‑count systems.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
- Core Power — Specified core supply range of 1.07 V to 1.13 V for predictable power delivery and timing stability.
- Package & Mounting — 1517‑BBGA FCBGA package (supplier: 1517‑FBGA, FC 40×40) with surface‑mount mounting type for compact board-level integration.
- Standards Compliance — RoHS compliant.
Typical Applications
- Industrial hardware designs — Industrial-grade temperature rating and high I/O count support temperature-challenging and I/O‑dense systems.
- High-density programmable logic — Large logic element count and substantial on‑chip RAM enable complex logic implementations and data buffering on a single device.
- Board-level integration — FCBGA 1517 package and surface‑mount compatibility simplify integration into compact, high‑pin‑count PCBs.
Unique Advantages
- Large programmable fabric: Approximately 420,000 logic elements reduce the need for multiple devices in high‑complexity designs.
- Significant embedded memory: ~23.6 Mbits of on‑chip RAM provides local storage for algorithms, DMA buffers, and temporary data without external memory.
- High I/O density: 704 I/O pins allow broad peripheral connectivity and flexible system partitioning.
- Industry temperature robustness: −40 °C to 100 °C rating supports deployment in harsh or industrial environments.
- Compact package: 1517‑FBGA (40×40) FCBGA package enables high‑density board layouts while maintaining surface‑mount assembly compatibility.
- Regulatory readiness: RoHS compliance aligns with common environmental and manufacturing requirements.
Why Choose 5AGXMB5G4F40I5G?
The 5AGXMB5G4F40I5G Arria V GX FPGA combines a high logic element count, considerable embedded RAM, and a large I/O complement in an industrial‑rated, RoHS‑compliant FCBGA package. Its tightly specified core voltage and broad operating temperature range make it appropriate for designs demanding deterministic power and environmental reliability.
This device suits engineering teams building high‑density programmable systems that prioritize integration, I/O flexibility, and thermal resilience, while maintaining the advantages of a single‑device FPGA solution.
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