5CEBA2F17A7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 2002944 25000 256-LBGA |
|---|---|
| Quantity | 1,154 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 128 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9434 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 2002944 |
Overview of 5CEBA2F17A7N – Cyclone® V E FPGA, 25,000 logic elements, 128 I/O, 256‑LBGA
The 5CEBA2F17A7N is a Cyclone® V E field-programmable gate array (FPGA) IC delivering 25,000 logic elements and approximately 2.00 Mbits of embedded memory in a 256‑LBGA footprint. It combines FPGA fabric density with a broad I/O count and automotive-grade qualification for designs that require integration, thermal resilience, and mid-range logic capacity.
Part of the Cyclone V family, this device targets industrial, wireless/wireline, military, and automotive markets where on-chip memory, deterministic I/O, and robust operating range are important design considerations.
Key Features
- Logic Capacity — 25,000 logic elements suitable for mid-density FPGA designs.
- Embedded Memory — Approximately 2.00 Mbits (2,002,944 bits) of on-chip RAM to support buffering, lookup tables, and small data stores.
- I/O — 128 general-purpose I/O pins to interface with sensors, peripherals, and external devices.
- Voltage Supply — Core supply range of 1.07 V to 1.13 V, matching a 1.1 V-class core requirement for stable operation.
- Automotive Qualification and Temperature Range — AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C for designs requiring automotive-grade reliability.
- Packaging and Mounting — 256‑LBGA package; supplier device package listed as 256‑FBGA (17×17); surface-mount mounting type for standard PCB assembly.
- Compliance — RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Automotive Electronics — AEC‑Q100 qualification and −40°C to 125°C operation make this FPGA appropriate for automotive electronic control and subsystem processing where temperature resilience is required.
- Industrial Systems — Mid-density logic and on-chip memory support control logic, sensor aggregation, and real-time processing in industrial equipment.
- Wireless and Wireline Equipment — Sizable I/O and embedded RAM accommodate protocol handling, buffering, and interface glue logic in communications equipment.
- Military and Ruggedized Designs — Broad operating temperature and qualification status suit systems that demand robust component behavior in challenging environments.
Unique Advantages
- Automotive-Grade Qualification: AEC‑Q100 qualification plus wide temperature range supports deployment in vehicle electronics and other harsh environments.
- Balanced Logic and Memory: 25,000 logic elements with approximately 2.00 Mbits of embedded memory provide a balanced resource set for mid-range FPGA designs without excessive BOM complexity.
- High I/O Count: 128 I/O pins give designers flexibility for sensor interfaces, peripheral control, and multi-lane connectivity.
- Compact Surface-Mount Package: 256‑LBGA / 256‑FBGA (17×17) packaging enables high-density board layouts while supporting industry-standard assembly processes.
- Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing requirements for commercial distribution.
Why Choose 5CEBA2F17A7N?
The 5CEBA2F17A7N delivers a practical combination of mid-range logic capacity, embedded memory, and a high I/O count in an automotive-qualified FPGA package. It is positioned for designs that require reliable operation across wide temperatures and demand an integrated, configurable logic solution without escalating system complexity.
Engineers and procurement teams seeking a scalable, robust FPGA for automotive, industrial, communications, or military applications will find this Cyclone V E device aligns technical capability with qualification and packaging options for production deployments.
Request a quote or submit an inquiry to receive pricing and availability for the 5CEBA2F17A7N and to discuss volume options or delivery timelines.

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