5AGZME7K3F40I4N

IC FPGA 674 I/O 1517FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 674 40249344 450000 1517-BBGA, FCBGA

Quantity 1,572 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O674Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21225Number of Logic Elements/Cells450000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40249344

Overview of 5AGZME7K3F40I4N – Arria V GZ FPGA, 1517-BBGA (FCBGA)

The 5AGZME7K3F40I4N is an Intel Arria V GZ Field Programmable Gate Array supplied in a 1517-BBGA (FCBGA) package. It delivers a high-density programmable fabric suitable for industrial-grade applications, combining a large logic capacity with substantial on-chip embedded memory and extensive I/O.

Comprehensive device documentation—covering electrical characteristics, switching characteristics, configuration specifications, and I/O timing—is available in the Arria V device datasheet to support design, validation, and integration efforts.

Key Features

  • High logic capacity — 450,000 logic elements (cells) provide significant programmable resources for complex digital designs.
  • Embedded memory — Approximately 40.25 Mbits of on-chip RAM (40,249,344 bits) to support buffering, lookup tables, and data storage on-device.
  • Extensive I/O — Up to 674 user I/O pins to accommodate dense external connectivity and parallel interfaces.
  • Industrial temperature grade — Rated for operation from –40 °C to 100 °C, suitable for industrial environment deployments.
  • Low-voltage core supply — Core voltage supply specified from 820 mV to 880 mV, supporting low-voltage system integration.
  • Package and mounting — 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for board-level assembly.
  • RoHS compliant — Conforms to RoHS environmental requirements.
  • Documented performance and configuration — Datasheet sections include electrical characteristics, transceiver and periphery performance specifications, configuration timing and methods, and I/O timing details to aid system design.

Typical Applications

  • Industrial control and automation — Industrial-grade temperature range and robust I/O count make this device suitable for control systems and factory automation logic.
  • High-density programmable logic — Large logic element count and sizable embedded memory support complex digital processing and custom logic implementations.
  • I/O-intensive systems — 674 I/O pins enable integration with multiple peripherals, sensors, and parallel interfaces.
  • Embedded system integration — Documented configuration and timing specifications facilitate deployment in embedded designs that require on-chip memory and flexible I/O.

Unique Advantages

  • Significant on-chip resources: 450,000 logic elements with approximately 40.25 Mbits of embedded RAM reduce the need for external logic and memory components.
  • Wide operating temperature: –40 °C to 100 °C rating supports reliable operation in industrial environments.
  • High I/O density: 674 I/O pins simplify connections to external devices and enable flexible board-level partitioning.
  • Compact surface-mount package: 1517-BBGA (40×40) offers a high-pin-count solution in a space-efficient footprint for dense PCB layouts.
  • Low core voltage: 820–880 mV supply range aligns with modern low-voltage power architectures for efficient system power design.
  • Well-documented device behavior: Detailed datasheet coverage of electrical, switching, configuration, and I/O timing supports robust design verification and integration.

Why Choose 5AGZME7K3F40I4N?

The 5AGZME7K3F40I4N Arria V GZ FPGA combines large programmable capacity, substantial embedded memory, and a high I/O count in an industrial-grade package. These attributes make it a strong candidate for designs that require dense logic integration, sizable on-chip memory, and extensive external connectivity while operating across a wide temperature range.

Engineers seeking a solution with documented electrical and configuration specifications will find the available datasheet material useful for system-level planning, validation, and production deployment.

Request a quote or submit a pricing inquiry to get detailed availability and lead-time information for the 5AGZME7K3F40I4N. Technical documentation is available in the device datasheet to assist your evaluation and integration process.

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