5AGZME7K3F40C4G

IC FPGA 674 I/O 1517FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 674 40249344 450000 1517-BBGA, FCBGA

Quantity 116 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O674Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21225Number of Logic Elements/Cells450000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits40249344

Overview of 5AGZME7K3F40C4G – Arria V GZ FPGA, 450,000 logic elements, 1517-BBGA

The 5AGZME7K3F40C4G is an Arria V GZ field-programmable gate array in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package. It delivers a large programmable fabric with 450,000 logic elements and approximately 40 Mbits of embedded memory for dense, complex logic implementations.

With 674 available I/Os, a surface-mount package, a defined core voltage range of 820 mV to 880 mV, and commercial operating range from 0 °C to 85 °C, this device addresses designs that require high logic capacity, substantial on-chip RAM, and high external connectivity.

Key Features

  • Logic Capacity  450,000 logic elements for large-scale programmable logic and complex custom functions.
  • Embedded Memory  Approximately 40 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • High I/O Count  674 I/Os to support dense external interfacing and multi-channel connectivity.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for board-level integration.
  • Power Supply  Core voltage supply specified from 820 mV to 880 mV to match system power delivery requirements.
  • Commercial Grade  Rated for commercial operating temperatures from 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant for regulatory and environmental considerations.
  • Comprehensive Documentation  Datasheet coverage includes electrical characteristics, switching behavior, configuration timing, and I/O timing for detailed system design and validation.

Typical Applications

  • High-density signal processing  Use the large logic fabric and on-chip RAM to implement complex DSP, filtering, and parallel data pipelines.
  • Multi-channel interfacing and bridging  674 I/Os provide capacity for aggregating and routing numerous external interfaces in a single device.
  • Embedded acceleration  Leverage the programmable logic and memory to offload compute-intensive tasks and accelerate embedded workloads.
  • Large FPGA prototypes  Suitable for prototyping and verifying large FPGA designs that require substantial logic and I/O resources.

Unique Advantages

  • High logic density: 450,000 logic elements enable implementation of large, integrated custom logic designs without immediate need for multiple devices.
  • Significant on-chip RAM: Approximately 40 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage tasks.
  • Extensive I/O capability: 674 I/Os support complex systems with multiple interfaces and parallel data paths.
  • Compact FCBGA packaging: 1517-BBGA (40×40) package offers a compact footprint for high-density PCB designs while supporting surface-mount assembly.
  • Clear electrical envelope: Defined core voltage range (820–880 mV) and commercial temperature rating (0 °C–85 °C) simplify power and thermal planning.
  • Regulatory-ready: RoHS compliance supports environmentally conscious product requirements.

Why Choose 5AGZME7K3F40C4G?

The 5AGZME7K3F40C4G Arria V GZ FPGA is positioned for designs that demand a large programmable fabric, substantial embedded memory, and a very high I/O count in a compact FCBGA package. Its documented electrical and configuration specifications provide the detail engineers need to integrate the device into complex systems with defined power and thermal envelopes.

This part is suited for teams implementing dense logic functions, multi-interface bridging, or embedded acceleration where on-chip resources and I/O density are primary selection criteria. The included datasheet material supports design, validation, and configuration planning for production deployment.

Request a quote or submit a pricing inquiry for the 5AGZME7K3F40C4G to check availability and receive tailored pricing information.

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