5AGZME7K2F40I3LG
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 674 40249344 450000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,346 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 674 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21225 | Number of Logic Elements/Cells | 450000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 40249344 |
Overview of 5AGZME7K2F40I3LG – Arria V GZ Field Programmable Gate Array (FPGA)
The 5AGZME7K2F40I3LG is an Intel Arria V GZ field programmable gate array delivered in a 1517-BBGA FCBGA package. It provides high logic density and large on-chip memory with a wide I/O count in an industrial-grade device designed for surface-mount assembly.
Typical uses leverage the device’s high logic element count, substantial embedded RAM, and broad I/O to address complex, high-density FPGA designs where operating range and board-level integration matter.
Key Features
- Core Logic Approximately 450,000 logic elements (logic cells) for large, complex designs and high integration of digital functions.
- Embedded Memory Approximately 40.25 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- I/O Density 674 general-purpose I/O pins to simplify external interfacing and system connectivity.
- Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for high-density PCB designs.
- Power Core voltage supply range from 820 mV to 880 mV to match board power-domain requirements.
- Industrial Temperature Range Rated for operation from –40°C to 100°C and specified as Industrial grade for extended-environment applications.
- Standards Compliance RoHS compliant.
Typical Applications
- Industrial Control and Automation Use the device’s high logic density and industrial temperature rating to implement complex control logic, sequencing, and I/O aggregation in factory and process equipment.
- High-density Digital Processing Leverage the large logic element count and embedded RAM for DSP-like workloads, custom packet processing, or data-path acceleration that require substantial on-chip resources.
- System Integration and I/O Bridging 674 I/Os accommodate multi-sensor interfaces, board-level bridges, and front-end aggregation where many external signals must be managed.
Unique Advantages
- High Logic Capacity: Approximately 450,000 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM and board complexity.
- Significant On-chip Memory: Approximately 40.25 Mbits of embedded RAM provide local storage for buffering, tables, and latency-sensitive data paths.
- Extensive I/O Count: 674 I/Os simplify external connectivity and reduce the need for auxiliary I/O expanders.
- Industrial-grade Operation: –40°C to 100°C temperature rating supports deployment in harsher environments and extended-temperature installations.
- Compact, High-density Package: 1517-BBGA (1517-FBGA supplier package) in a surface-mount form factor helps save board area while supporting complex routing.
- Optimized Core Power Range: 0.820–0.880 V core supply range supports integration with modern power architectures and controlled power-domain design.
Why Choose 5AGZME7K2F40I3LG?
This Arria V GZ FPGA balances high logic capacity, substantial embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. It is suited for engineers and procurement teams targeting consolidated FPGA implementations that require robust operation across a wide temperature range and board-level integration in a compact footprint.
Choose this part when your design requires significant on-chip resources, extensive external interfacing, and an industrial operating window—while maintaining compliance with RoHS requirements and standard surface-mount assembly practices.
Request a quote or submit a purchase inquiry to obtain pricing and availability for 5AGZME7K2F40I3LG.

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