5AGZME7K2F40I3LG

IC FPGA 674 I/O 1517FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 674 40249344 450000 1517-BBGA, FCBGA

Quantity 1,346 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O674Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21225Number of Logic Elements/Cells450000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits40249344

Overview of 5AGZME7K2F40I3LG – Arria V GZ Field Programmable Gate Array (FPGA)

The 5AGZME7K2F40I3LG is an Intel Arria V GZ field programmable gate array delivered in a 1517-BBGA FCBGA package. It provides high logic density and large on-chip memory with a wide I/O count in an industrial-grade device designed for surface-mount assembly.

Typical uses leverage the device’s high logic element count, substantial embedded RAM, and broad I/O to address complex, high-density FPGA designs where operating range and board-level integration matter.

Key Features

  • Core Logic  Approximately 450,000 logic elements (logic cells) for large, complex designs and high integration of digital functions.
  • Embedded Memory  Approximately 40.25 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • I/O Density  674 general-purpose I/O pins to simplify external interfacing and system connectivity.
  • Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for high-density PCB designs.
  • Power  Core voltage supply range from 820 mV to 880 mV to match board power-domain requirements.
  • Industrial Temperature Range  Rated for operation from –40°C to 100°C and specified as Industrial grade for extended-environment applications.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Use the device’s high logic density and industrial temperature rating to implement complex control logic, sequencing, and I/O aggregation in factory and process equipment.
  • High-density Digital Processing  Leverage the large logic element count and embedded RAM for DSP-like workloads, custom packet processing, or data-path acceleration that require substantial on-chip resources.
  • System Integration and I/O Bridging  674 I/Os accommodate multi-sensor interfaces, board-level bridges, and front-end aggregation where many external signals must be managed.

Unique Advantages

  • High Logic Capacity: Approximately 450,000 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM and board complexity.
  • Significant On-chip Memory: Approximately 40.25 Mbits of embedded RAM provide local storage for buffering, tables, and latency-sensitive data paths.
  • Extensive I/O Count: 674 I/Os simplify external connectivity and reduce the need for auxiliary I/O expanders.
  • Industrial-grade Operation: –40°C to 100°C temperature rating supports deployment in harsher environments and extended-temperature installations.
  • Compact, High-density Package: 1517-BBGA (1517-FBGA supplier package) in a surface-mount form factor helps save board area while supporting complex routing.
  • Optimized Core Power Range: 0.820–0.880 V core supply range supports integration with modern power architectures and controlled power-domain design.

Why Choose 5AGZME7K2F40I3LG?

This Arria V GZ FPGA balances high logic capacity, substantial embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. It is suited for engineers and procurement teams targeting consolidated FPGA implementations that require robust operation across a wide temperature range and board-level integration in a compact footprint.

Choose this part when your design requires significant on-chip resources, extensive external interfacing, and an industrial operating window—while maintaining compliance with RoHS requirements and standard surface-mount assembly practices.

Request a quote or submit a purchase inquiry to obtain pricing and availability for 5AGZME7K2F40I3LG.

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