5AGZME7H3F35I4G

IC FPGA 534 I/O 1152FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 534 40249344 450000 1152-BBGA, FCBGA

Quantity 474 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O534Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21225Number of Logic Elements/Cells450000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits40249344

Overview of 5AGZME7H3F35I4G – Arria V GZ Field Programmable Gate Array (FPGA), 534 I/O, 450,000 logic elements

The 5AGZME7H3F35I4G is an Arria V GZ family FPGA offered in an industrial grade device. It delivers high-density programmable logic and on-chip memory in a surface-mount 1152-BBGA (FCBGA) package suited for designs that require substantial logic capacity, abundant I/O, and controlled core power delivery.

Typical integration targets include industrial embedded systems and high-density logic implementations where a combination of logic resources, embedded RAM, and a wide operating temperature range are required.

Key Features

  • Logic capacity — 450,000 logic elements, providing large programmable logic resources for complex designs.
  • Configurable logic blocks (CLBs) — 21,225 CLBs to structure and map logic functions efficiently.
  • Embedded memory — approximately 40.2 Mbits of on-chip RAM (40,249,344 total RAM bits) to support buffering, LUTRAM and local storage without external memory.
  • High I/O count — 534 I/O pins for extensive peripheral, sensor, and bus interfacing.
  • Package & mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35), surface-mount mounting for compact board integration.
  • Power domain — core voltage supply range of 820 mV to 880 mV, enabling defined core-power planning and regulation.
  • Industrial operating range — rated for −40 °C to 100 °C operation for use in thermally demanding environments.
  • RoHS compliant — meets RoHS environmental requirements as supplied.

Typical Applications

  • Industrial embedded systems — Leveraging industrial-grade temperature and broad logic/memory resources for control, signal processing, and automation tasks.
  • High-density logic implementations — Large logic element count and CLBs enable complex state machines, datapaths, and hardware-accelerated functions.
  • I/O-intensive interfaces — 534 I/O allow integration with multiple peripherals, sensors, and external buses in compact board layouts.

Unique Advantages

  • High logic density: 450,000 logic elements provide capacity for substantial hardware functionality on a single device, reducing the need for multiple FPGAs.
  • Significant on-chip memory: Approximately 40.2 Mbits of embedded RAM supports local buffering and data handling without immediate reliance on external memory.
  • Robust I/O capability: 534 I/O pins enable flexible system partitioning and numerous peripheral connections.
  • Industrial temperature rating: −40 °C to 100 °C operation expands deployment options into harsher environments where thermal resilience is required.
  • Compact high-pin-count package: 1152-BBGA (35×35) FCBGA packaging balances high I/O and density with surface-mount assembly for space-constrained designs.
  • Defined core power range: 820–880 mV supply requirement simplifies power budgeting and regulator selection for the core domain.

Why Choose 5AGZME7H3F35I4G?

The 5AGZME7H3F35I4G Arria V GZ FPGA combines substantial programmable logic, sizeable embedded RAM, and a high I/O count in a surface-mount FCBGA package rated for industrial operation. Its defined core-voltage range and RoHS compliance make it suitable for engineered systems that need predictable power design and environmental compliance.

This device is well suited to engineering teams building complex, high-density designs that require on-chip memory and extensive interfacing while operating across a wide temperature range. Its resource profile supports scalability within a design family and aligns with applications that prioritize integration and long-term platform stability.

Request a quote or submit a procurement inquiry to obtain pricing, lead-time, and availability information for the 5AGZME7H3F35I4G Arria V GZ FPGA.

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