5AGZME7H3F35C4G

The 5AGZME7H3F35C4G is an Arria V GZ field programmable gate array (FPGA) IC from Intel, offered in a 1152‑BBGA (FCBGA) package. It provides high logic density with a large on‑chip RAM footprint and extensive I/O capability for commercial designs.

With 450,000 logic elements, approximately 40 Mbits of on‑chip RAM, and 534 I/Os, this FPGA is intended for applications that require consolidated programmable logic, significant embedded memory, and broad external connectivity while operating within a commercial temperature range.

Key Features

• Core Logic Density  450,000 logic elements enable implementation of complex digital functions and high‑density logic integration.
• On‑chip Memory  Approximately 40 Mbits of total RAM bits for buffering, lookup tables, and state storage without immediate dependence on external memory.
• I/O Capacity  534 general‑purpose I/Os for broad signal aggregation, interfacing, and routing to external subsystems.
• Package  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA 35×35) in a surface‑mount form factor for high‑pin‑count PCB designs.
• Power Supply  Core voltage operating range: 820 mV to 880 mV (0.820–0.880 V).
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance  Surface mount device; RoHS compliant.

Typical Applications

• High‑density digital systems  Consolidate and accelerate complex logic functions using the device’s 450,000 logic elements and on‑chip RAM.
• I/O‑intensive interfaces  Aggregate and route large numbers of signals or peripherals leveraging 534 available I/Os.
• System prototyping and integration  Validate and integrate multi‑module digital designs where substantial programmable fabric and embedded memory simplify board-level architecture.

Unique Advantages

• Substantial programmable capacity: 450,000 logic elements allow large designs or multiple functions to be implemented within a single FPGA device.
• Significant embedded memory: Approximately 40 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive external connectivity: 534 I/Os provide the pin count needed for dense peripheral, sensor, or high‑channel count interfaces.
• High‑pin‑count surface‑mount package: 1152‑BBGA (FCBGA) and supplier 1152‑FBGA (35×35) package density supports routing for complex PCB implementations.
• Commercial operating range: Rated for 0 °C to 85 °C to match typical commercial deployment environments.
• Environmentally compliant: RoHS compliant for assemblies requiring lead‑free components.

Why Choose 5AGZME7H3F35C4G?

The 5AGZME7H3F35C4G Arria V GZ FPGA delivers a balanced combination of high logic density, substantial on‑chip RAM, and a large I/O count in a compact surface‑mount FCBGA package. As a commercial‑grade Intel Arria V device, it is suitable for engineers and system designers who need to consolidate functions, accelerate development, and maintain flexible hardware configurability within commercial temperature limits.

Choose this device when your design requires a high number of logic elements, meaningful embedded memory capacity, and wide connectivity options while benefiting from Intel’s Arria V family documentation and support resources.

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