5AGZME7H2F35C3N

The 5AGZME7H2F35C3N is an Intel Arria V GZ family FPGA supplied in a 1152-FBGA (35×35) surface-mount package. It is a commercial-grade device specified for operation from 0 °C to 85 °C and RoHS compliant.

With 450,000 logic elements, approximately 40 Mbits of embedded memory, and 534 user I/O pins, this device targets high-density programmable logic implementations and I/O-rich commercial embedded designs that require a large on-chip resource set in a compact FCBGA package.

Key Features

• Core logic capacity — 450,000 logic elements for implementing complex digital functions and large-scale programmable logic designs.
• Embedded memory — Total on-chip RAM of 40,249,344 bits (approximately 40 Mbits) to support buffering, state storage, and memory-intensive logic.
• I/O density — 534 user I/O pins to interface with multiple peripherals, buses, and high-pin-count subsystems.
• Power requirements — Core voltage supply specified between 820 mV and 880 mV, enabling precise power planning for the device core.
• Package & mounting — 1152-BBGA (FCBGA) supplier device package (35×35), surface-mount mounting for compact board-level integration.
• Commercial grade temperature — Rated for operation from 0 °C to 85 °C, suited for commercial-environment applications.
• Standards compliance — RoHS compliant, supporting regulatory and environmental requirements.

Typical Applications

• Custom digital processing — Use the large logic capacity and embedded memory to implement application-specific accelerators, state machines, and signal-processing pipelines.
• High-density system integration — 534 I/O pins and a compact 1152-FBGA package allow integration of multiple interfaces and peripherals on a single FPGA for complex embedded platforms.
• Prototyping and product development — Commercial-grade temperature range and extensive on-chip resources make the device suitable for evaluating and developing production-ready programmable logic designs.

Unique Advantages

• Large programmable fabric: 450,000 logic elements provide a high-capacity platform for implementing complex, multi-function digital designs without offloading to external logic.
• Substantial on-chip memory: Approximately 40 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage.
• High I/O count: 534 user I/O pins enable rich peripheral connectivity and multiple parallel interfaces from a single device.
• Compact, manufacturable package: 1152-FBGA (35×35) surface-mount footprint balances density with board-level assembly practicality.
• Defined power envelope: Core supply range of 820 mV to 880 mV supports precise power-supply design and regulator selection.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for deployment in commercial applications.

Why Choose 5AGZME7H2F35C3N?

The 5AGZME7H2F35C3N provides a high-density Arria V GZ FPGA option with substantial logic and embedded memory resources in a production-friendly FCBGA package. Its combination of 450,000 logic elements, approximately 40 Mbits of on-chip RAM, and 534 I/O pins makes it well suited to commercial embedded systems that require significant on-chip compute, memory, and interfacing capability.

For designs where board space, I/O count, and integrated memory matter, this Intel Arria V GZ device delivers a defined electrical and thermal profile to simplify system-level planning and integration.

Request a quote or submit an inquiry for part number 5AGZME7H2F35C3N to receive pricing and availability details tailored to your project requirements.