5AGZME7H2F35C3G

The 5AGZME7H2F35C3G is an Arria V GZ field programmable gate array (FPGA) IC from Intel, provided in a high-density 1152-ball BGA package. It delivers a combination of large programmable logic capacity, substantial on-chip memory, and a high I/O count for complex embedded and communications-oriented designs.

This commercial-grade device is suited to applications that require high logic density, significant embedded memory, and extensive external connectivity while meeting standard commercial operating conditions.

Key Features

• Logic Capacity — Approximately 450,000 logic elements (cells) for implementing large-scale programmable logic and custom hardware functions.
• Embedded Memory — Approximately 40 Mbits of on-chip RAM (total RAM bits: 40,249,344) to support buffering, lookup tables, and state storage without external memory dependence.
• I/O Density — 534 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-bandwidth external connectivity.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35×35)) with surface-mount mounting type for compact, high-reliability board integration.
• Power — Specified core voltage supply range of 820 mV to 880 mV, enabling designers to plan power delivery and thermal budgets accurately.
• Operating Range — Commercial operating temperature range 0 °C to 85 °C suitable for standard consumer and industrial-adjacent electronics environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly and shipment.

Typical Applications

• Communications & Networking: High logic density and extensive I/O make this FPGA suitable for protocol processing, packet handling, and custom data-plane acceleration tasks.
• High-Performance Embedded Systems: Large on-chip RAM and abundant logic elements support complex control algorithms, DSP functions, and system orchestration without heavy external memory reliance.
• Industrial Automation & Control: Multiple I/Os and programmable logic density enable integration of motor control, sensor aggregation, and real-time control functions in a single device.

Unique Advantages

• High Programmable Density: Approximately 450,000 logic elements allow extensive hardware customization and partitioning of functions across a single chip.
• Substantial On-Chip Memory: Approximately 40 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and improving system latency.
• Broad External Connectivity: 534 I/O pins provide flexibility to interface with multiple high-speed peripherals and parallel buses simultaneously.
• Compact, Manufacturable Package: 1152-ball BGA (supplier 1152-FBGA (35×35)) in a surface-mount format supports dense PCB layouts and automated assembly.
• Defined Power Envelope: Core supply range of 820 mV–880 mV enables predictable power delivery design and thermal planning.
• Commercial Qualification: Operates across a 0 °C–85 °C range and is RoHS compliant for standard commercial deployments.

Why Choose 5AGZME7H2F35C3G?

The 5AGZME7H2F35C3G delivers a balance of high logic capacity, ample on-chip memory, and extensive I/O in a single commercial-grade Arria V GZ FPGA package. Its configuration is aimed at designers who need to consolidate complex processing, custom logic, and multiple interfaces into a compact, surface-mount BGA footprint.

Choose this device for designs that demand scalability in programmable logic and memory resources while maintaining clear power and thermal parameters. Its RoHS compliance and common commercial temperature range make it straightforward to integrate into standard production builds.

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