5AGZME5K3F40I4G

IC FPGA 674 I/O 1517FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 674 34322432 400000 1517-BBGA, FCBGA

Quantity 690 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O674Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18870Number of Logic Elements/Cells400000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits34322432

Overview of 5AGZME5K3F40I4G – Arria V GZ Field Programmable Gate Array (FPGA), 400,000 logic elements

The 5AGZME5K3F40I4G is an Intel Arria V GZ Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount assembly. This industrial-grade device provides a high-density programmable fabric with a broad I/O complement and significant on-chip memory, suitable for designs requiring configurable logic, embedded memory, and extensive peripheral connectivity.

Key technical attributes include 400,000 logic elements, approximately 34.3 Mbits of embedded memory, 674 I/O pins, a core voltage operating range of 820 mV to 880 mV, and an operating temperature range of –40°C to 100°C. The available device documentation describes electrical characteristics, transceiver performance, PCIe hard-IP references, HPS specifications, and configuration timing details.

Key Features

  • Core Density  400,000 logic elements (cells) provide programmable fabric capacity for complex logic and custom acceleration tasks.
  • Embedded Memory  Approximately 34.3 Mbits of on-chip RAM for buffering, LUT-based storage, and in-field data processing.
  • I/O and Connectivity  674 I/O pins enable broad external interfacing and high pin-count system integration.
  • Transceiver and Periphery Support  Device documentation includes transceiver performance specifications and references to PCIe hard-IP blocks and periphery circuitry.
  • Power and Voltage  Core supply operation across a defined range of 820 mV to 880 mV to match system power architecture needs.
  • Package and Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting type for compact board integration.
  • Industrial Operating Range  Rated for –40°C to 100°C operation, suitable for temperature-demanding environments.
  • Standards and Compliance  RoHS-compliant construction supports regulatory and manufacturing requirements.

Typical Applications

  • High-speed connectivity and switching  Transceiver performance specifications and PCIe hard-IP references in the device documentation align this FPGA with designs that require high-speed serial links and peripheral interfacing.
  • Embedded processing and system integration  HPS specifications and abundant logic and memory resources support integration of custom control and data-path functions within a single device.
  • Industrial control and instrumentation  Industrial-grade rating and wide operating temperature range make the device suitable for control, monitoring, and instrumentation applications in demanding environments.
  • Signal processing and data buffering  Large on-chip RAM and dense logic element count enable real-time processing, buffering, and pre-aggregation of streaming data.

Unique Advantages

  • High logic capacity: 400,000 logic elements allow consolidation of multiple functions into a single FPGA fabric, reducing external components.
  • Substantial embedded memory: Approximately 34.3 Mbits of on-chip RAM supports large data buffers and state storage without relying on external memory.
  • Extensive I/O: 674 I/O pins provide flexibility for dense peripheral interfacing, expansion, and board-level integration.
  • Industrial temperature rating: Specified operation from –40°C to 100°C supports deployments in temperature-challenging environments.
  • Low-voltage core operation: Defined core supply range (820 mV–880 mV) enables power-optimized system design.
  • Surface-mount FCBGA package: 1517-BBGA (1517-FBGA, 40×40) format supports compact PCB footprints and automated assembly processes.

Why Choose 5AGZME5K3F40I4G?

The 5AGZME5K3F40I4G Arria V GZ FPGA combines a high logic element count, significant embedded RAM, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. Its documented support for transceiver performance and PCIe hard-IP references, along with comprehensive configuration and timing details in the device documentation, make it a practical choice for developers building complex, high-throughput, or temperature-challenging systems.

This device suits design teams that need scalable programmable logic, ample on-chip memory, and broad interfacing capabilities while retaining industrial operating specifications and RoHS compliance. The combination of density, memory, and I/O enables system consolidation, reduced BOM, and flexibility for evolving feature requirements.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the 5AGZME5K3F40I4G Arria V GZ FPGA.

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