5AGZME5K3F40I4G
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 674 34322432 400000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 690 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 674 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18870 | Number of Logic Elements/Cells | 400000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34322432 |
Overview of 5AGZME5K3F40I4G – Arria V GZ Field Programmable Gate Array (FPGA), 400,000 logic elements
The 5AGZME5K3F40I4G is an Intel Arria V GZ Field Programmable Gate Array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount assembly. This industrial-grade device provides a high-density programmable fabric with a broad I/O complement and significant on-chip memory, suitable for designs requiring configurable logic, embedded memory, and extensive peripheral connectivity.
Key technical attributes include 400,000 logic elements, approximately 34.3 Mbits of embedded memory, 674 I/O pins, a core voltage operating range of 820 mV to 880 mV, and an operating temperature range of –40°C to 100°C. The available device documentation describes electrical characteristics, transceiver performance, PCIe hard-IP references, HPS specifications, and configuration timing details.
Key Features
- Core Density 400,000 logic elements (cells) provide programmable fabric capacity for complex logic and custom acceleration tasks.
- Embedded Memory Approximately 34.3 Mbits of on-chip RAM for buffering, LUT-based storage, and in-field data processing.
- I/O and Connectivity 674 I/O pins enable broad external interfacing and high pin-count system integration.
- Transceiver and Periphery Support Device documentation includes transceiver performance specifications and references to PCIe hard-IP blocks and periphery circuitry.
- Power and Voltage Core supply operation across a defined range of 820 mV to 880 mV to match system power architecture needs.
- Package and Mounting 1517-BBGA (1517-FBGA, 40×40) FCBGA package with surface-mount mounting type for compact board integration.
- Industrial Operating Range Rated for –40°C to 100°C operation, suitable for temperature-demanding environments.
- Standards and Compliance RoHS-compliant construction supports regulatory and manufacturing requirements.
Typical Applications
- High-speed connectivity and switching Transceiver performance specifications and PCIe hard-IP references in the device documentation align this FPGA with designs that require high-speed serial links and peripheral interfacing.
- Embedded processing and system integration HPS specifications and abundant logic and memory resources support integration of custom control and data-path functions within a single device.
- Industrial control and instrumentation Industrial-grade rating and wide operating temperature range make the device suitable for control, monitoring, and instrumentation applications in demanding environments.
- Signal processing and data buffering Large on-chip RAM and dense logic element count enable real-time processing, buffering, and pre-aggregation of streaming data.
Unique Advantages
- High logic capacity: 400,000 logic elements allow consolidation of multiple functions into a single FPGA fabric, reducing external components.
- Substantial embedded memory: Approximately 34.3 Mbits of on-chip RAM supports large data buffers and state storage without relying on external memory.
- Extensive I/O: 674 I/O pins provide flexibility for dense peripheral interfacing, expansion, and board-level integration.
- Industrial temperature rating: Specified operation from –40°C to 100°C supports deployments in temperature-challenging environments.
- Low-voltage core operation: Defined core supply range (820 mV–880 mV) enables power-optimized system design.
- Surface-mount FCBGA package: 1517-BBGA (1517-FBGA, 40×40) format supports compact PCB footprints and automated assembly processes.
Why Choose 5AGZME5K3F40I4G?
The 5AGZME5K3F40I4G Arria V GZ FPGA combines a high logic element count, significant embedded RAM, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. Its documented support for transceiver performance and PCIe hard-IP references, along with comprehensive configuration and timing details in the device documentation, make it a practical choice for developers building complex, high-throughput, or temperature-challenging systems.
This device suits design teams that need scalable programmable logic, ample on-chip memory, and broad interfacing capabilities while retaining industrial operating specifications and RoHS compliance. The combination of density, memory, and I/O enables system consolidation, reduced BOM, and flexibility for evolving feature requirements.
Request a quote or submit an inquiry to receive pricing, availability, and support information for the 5AGZME5K3F40I4G Arria V GZ FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018