5AGZME5K2F40I3LG
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 674 34322432 400000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,077 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 674 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18870 | Number of Logic Elements/Cells | 400000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34322432 |
Overview of 5AGZME5K2F40I3LG – Arria V GZ Field Programmable Gate Array (FPGA) IC
The 5AGZME5K2F40I3LG is an Intel Arria V GZ FPGA delivered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It provides a high-capacity programmable logic fabric with 400,000 logic elements, approximately 34.3 Mbits of embedded RAM, and 674 general-purpose I/Os.
Rated for industrial operation (–40 °C to 100 °C) and RoHS compliant, this device targets designs that require large on-chip logic and memory capacity, extensive I/O connectivity, and a compact BGA package with surface-mount mounting.
Key Features
- Core capacity — 400,000 logic elements for large-scale programmable logic implementations and complex design integration.
- Embedded memory — Approximately 34.3 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
- High I/O count — 674 I/Os to accommodate multiple interfaces, parallel buses, and extensive peripheral connections.
- Package and mounting — 1517-BBGA (Supplier Device Package: 1517-FBGA, 40×40) in a surface-mount FCBGA form factor for dense board-level integration.
- Voltage supply — Core supply range specified at 820 mV to 880 mV to align with system power budgeting and core performance settings.
- Industrial temperature range — Rated for operation from –40 °C to 100 °C, suitable for temperature-challenging environments.
- Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free designs.
Typical Applications
- High-density programmable logic — Leverage 400,000 logic elements to consolidate complex digital functions and custom processing blocks on-chip.
- Memory-intensive designs — Use the approximately 34.3 Mbits of embedded RAM for on-chip buffering, look-up tables, and temporary data storage to reduce external memory dependence.
- I/O-rich systems — Support multiple parallel interfaces, converters, and peripheral connectivity with 674 available I/Os.
- Industrial and harsh environments — Deploy in temperature-demanding applications thanks to the –40 °C to 100 °C operating range and industrial unit grade.
Unique Advantages
- Large programmable fabric: 400,000 logic elements enable consolidation of large, multi-function designs into a single device, simplifying system architecture.
- Substantial on-chip memory: Approximately 34.3 Mbits of embedded RAM reduces reliance on external memory and improves data throughput for latency-sensitive tasks.
- Broad I/O support: 674 I/Os let you connect numerous peripherals and interfaces without extensive board-level multiplexing.
- Industrial temperature capability: –40 °C to 100 °C rating supports deployment in industrial and temperature-challenging applications.
- Compact BGA footprint: 1517-BBGA / 1517-FBGA (40×40) package delivers high pin density in a space-efficient surface-mount form factor.
- Regulatory readiness: RoHS compliance helps meet environmental and manufacturing requirements.
Why Choose 5AGZME5K2F40I3LG?
The 5AGZME5K2F40I3LG Arria V GZ FPGA combines large logic capacity, substantial embedded memory, and a very high I/O count in a compact 1517-BBGA surface-mount package. Its industrial operating range and RoHS compliance make it a strong candidate for demanding embedded systems that require on-chip integration of complex digital functions and extensive peripheral interfacing.
This device is well suited to engineering teams designing high-density, memory-rich, and I/O-intensive systems who need scalable programmable logic with proven vendor support and comprehensive datasheet specifications for integration and configuration.
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