5AGZME5H3F35I4N

The 5AGZME5H3F35I4N is an Arria V GZ series FPGA from Intel supplied in an industrial-grade configuration. It delivers a high-density programmable logic fabric with 400,000 logic elements and approximately 34.3 Mbits of embedded memory, packaged in a high-pin-count FCBGA footprint for surface-mount applications.

This device is targeted at industrial programmable-logic deployments that require large on-chip memory, extensive I/O, and operation across an extended temperature range.

Key Features

• Logic Capacity — 400,000 logic elements for complex, high-density programmable designs.
• Embedded Memory — Approximately 34.3 Mbits of on-chip RAM to support large buffering, state storage, and data-path implementations.
• I/O Density — 534 user I/Os, enabling broad peripheral connectivity and multi-channel interfacing without external IO expanders.
• Package — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35) for compact, high‑pin-count board integration.
• Power — Core voltage supply range of 820 mV to 880 mV, suitable for the Arria V GZ core requirements.
• Temperature Rating — Industrial operating range from −40 °C to 100 °C for deployment in environmentally demanding installations.
• Mounting — Surface mount device simplifying automated PCB assembly.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device where rugged, industrial-temperature programmable logic is required for real-time control and signal processing.
• Embedded Systems — Integrate as the primary programmable fabric in embedded platforms that need significant logic capacity and on-chip RAM.
• High‑I/O Interface Hubs — Deploy in applications that require many external interfaces or channels enabled by the 534 I/Os.
• Prototype to Production FPGA Designs — Suitable for both development and production volumes where a high-density Arria V GZ device is specified.

Unique Advantages

• High Logic Density: 400,000 logic elements provide the capacity to implement complex functions and large custom accelerators on a single device.
• Substantial On‑Chip RAM: Approximately 34.3 Mbits of embedded memory reduces reliance on external memory for buffering and state storage.
• Extensive I/O Count: 534 I/Os simplify system design by accommodating multiple interfaces and peripherals directly on-chip.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact High‑Pin Package: 1152-pin FCBGA (1152-FBGA, 35×35) enables a dense PCB routing solution without sacrificing connectivity.
• Compliance and Assembly: RoHS compliance and surface-mount package support modern manufacturing and environmental requirements.

Why Choose 5AGZME5H3F35I4N?

The 5AGZME5H3F35I4N arranges substantial programmable logic, memory, and I/O resources in an industrial-grade Arria V GZ device, making it a practical choice for designers who need a self-contained, high-capacity FPGA solution. Its combination of 400,000 logic elements, approximately 34.3 Mbits of embedded RAM, and 534 I/Os supports complex implementations while the industrial temperature rating and RoHS compliance address reliability and environmental concerns.

This device is suited to engineering teams and procurement for systems that demand long-term robustness, scalable logic capacity, and dense external connectivity, backed by Intel’s Arria V family documentation and specifications.

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