5AGZME5H3F35C4N

The 5AGZME5H3F35C4N is an Intel Arria V GZ FPGA packaged in a 1152‑BBGA (35×35) FCBGA surface‑mount package. It provides high programmable logic capacity with 400,000 logic elements, approximately 34.3 Mbits of on‑chip RAM, and 534 user I/Os for designs that require dense logic, embedded memory, and broad connectivity.

Designed for commercial‑grade applications, the device operates from a core supply of 820 mV to 880 mV and across an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and intended for surface‑mount assembly.

Key Features

• Logic resources — 400,000 logic elements and 18,870 logic blocks provide large-scale programmable fabric for complex digital designs.
• Embedded memory — Approximately 34.3 Mbits of on‑chip RAM to support buffering, state storage, and local data processing without external memory.
• High I/O count — 534 I/O pins enable extensive peripheral and board‑level connectivity for multi‑interface designs.
• Package and mounting — 1152‑BBGA, FCBGA (35×35) package, surface‑mount mounting for compact board integration.
• Power and operating conditions — Core voltage range 820 mV to 880 mV; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant to support regulatory requirements for lead‑free assembly.

Typical Applications

• Custom FPGA‑based systems — Implement large custom logic functions and algorithm acceleration using the device’s high logic‑element count and embedded memory.
• I/O‑intensive designs — Support designs that require many external interfaces or parallel connections with 534 available I/Os.
• High‑density digital processing — Use on‑chip RAM and large logic resources for data buffering, pipeline stages, and complex control logic.
• Compact board implementations — The 1152‑BBGA FCBGA package enables high‑density mounting in space‑constrained systems.

Unique Advantages

• High integration density: 400,000 logic elements and substantial embedded memory reduce reliance on external components and simplify BOM.
• Broad I/O support: 534 I/Os provide design flexibility for multiple interfaces and parallel connectivity without extra I/O expanders.
• Commercial operating range: Specified 0 °C to 85 °C operation matches many commercial embedded and industrial environments.
• Compact, manufacturable package: 1152‑BBGA FCBGA package supports high‑density PCB layouts and surface‑mount assembly processes.
• Regulatory readiness: RoHS compliance helps streamline lead‑free production requirements.

Why Choose 5AGZME5H3F35C4N?

The 5AGZME5H3F35C4N positions itself as a high‑capacity, commercially rated Arria V GZ FPGA suitable for designs that demand large programmable logic resources, significant on‑chip memory, and abundant I/O. Its combination of 400,000 logic elements, approximately 34.3 Mbits of embedded RAM, and a 534‑pin I/O complement make it well suited to complex digital systems where integration density and connectivity matter.

For engineers and procurement teams building commercial‑grade FPGA solutions, this device delivers a balance of capacity, package density, and defined operating requirements that support robust, scalable designs backed by the Arria V GZ device specifications.

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