5AGZME5H2F35I3LN

The 5AGZME5H2F35I3LN is an Arria V GZ field programmable gate array (FPGA) IC from Intel, offered in an industrial-grade configuration. It provides a high density of programmable logic with substantial embedded memory and extensive I/O, packaged for surface-mount assembly.

Designed for applications that require large logic capacity, significant on-chip RAM, and a broad I/O count while operating across an industrial temperature range, this device targets demanding industrial and embedded system designs.

Key Features

• Logic Capacity — 400,000 logic elements for high-density programmable logic implementation.
• Embedded Memory — Approximately 34.3 Mbits of on-chip RAM (34,322,432 total RAM bits) to support buffering, FIFOs, and local data storage.
• I/O Density — 534 I/O pins to support extensive peripheral interfacing and parallel connectivity.
• Core Voltage — Core voltage supply range of 820 mV to 880 mV to match system power requirements.
• Package & Mounting — 1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) optimized for surface-mount PCB assembly.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Automation — High logic density and industrial temperature rating support control, monitoring, and real-time processing in industrial systems.
• Embedded Systems — Large on-chip RAM and abundant I/O enable local data handling and complex digital functions within embedded designs.
• Protocol Bridging & I/O Aggregation — Ample I/O and logic elements allow consolidation of multiple interfaces and protocol translation in a single device.
• High‑Density Digital Systems — Suited for designs that require substantial programmable logic and memory in a compact, surface‑mount package.

Unique Advantages

• High Logic Integration: 400,000 logic elements reduce the need for multiple devices, simplifying system architecture and lowering BOM complexity.
• Substantial On‑Chip Memory: Approximately 34.3 Mbits of embedded RAM supports buffering and local data processing without external memory.
• Extensive I/O Count: 534 I/Os enable broad peripheral support and flexible board-level connectivity.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade specification help maintain operation in demanding environments.
• Compact Surface‑Mount Package: 1152‑BBGA (35×35) FCBGA package provides high pin density in a compact footprint for space-constrained designs.
• Regulatory Compatibility: RoHS compliance supports modern manufacturing and supply-chain requirements.

Why Choose 5AGZME5H2F35I3LN?

The 5AGZME5H2F35I3LN delivers a balance of high logic density, significant embedded memory, and extensive I/O in a single industrial‑grade Arria V GZ FPGA. Its core voltage range and surface‑mount 1152‑BBGA package make it suitable for tightly integrated, high‑capability boards that must operate across wide temperature ranges.

This part is well suited for engineers and procurement teams building complex industrial and embedded systems that require scalable programmable logic capacity, on‑chip memory resources, and broad interfacing without compromising on form factor or RoHS compliance.

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