5AGZME5H2F35I3L

The 5AGZME5H2F35I3L is an Arria V GZ field programmable gate array (FPGA) in a 1152-BBGA surface-mount package. It provides a high-density reconfigurable logic fabric with extensive embedded memory and I/O, offered in an industrial-grade temperature range for robust operation.

Designed for systems that require large programmable logic capacity, significant on-chip memory, and a high count of I/O, this device targets industrial designs where integration, flexibility, and durable operation are priorities.

Key Features

• Logic Capacity — 603,840 logic elements to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory — Approximately 34.32 Mbits of on-chip RAM to support buffering, state storage, and data path functions without external memory.
• I/O Density — 534 I/O pins to enable wide external connectivity and interfacing with multiple peripherals and subsystems.
• Power Supply — Operates from an 820 mV to 880 mV core voltage range, allowing designers to plan power delivery and sequencing precisely.
• Package and Mounting — 1152-BBGA (supplier package listed as 1152-FBGA, 35×35) in a surface-mount footprint for compact board-level integration.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to meet the demands of industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes and regulatory compliance.

Typical Applications

• Industrial Control and Automation — Implement control logic, real-time processing, and sensor interfacing where industrial temperature operation and high I/O counts are required.
• High-density Digital Systems — Deploy large, customizable logic blocks and embedded RAM for complex data processing, protocol handling, and custom accelerators.
• Network and Communications Equipment — Provide flexible, reconfigurable logic and port-rich connectivity for protocol implementations and data-path processing.

Unique Advantages

• High Logic Integration: 603,840 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant On-chip Memory: Approximately 34.32 Mbits of embedded RAM reduce dependence on external memory and improve data throughput for latency-sensitive tasks.
• Ample I/O Resources: 534 I/O pins support extensive peripheral connectivity, simplifying system partitioning and interface design.
• Industrial-grade Reliability: Rated for -40 °C to 100 °C operation, suitable for extended-temperature industrial deployments.
• Compact Surface-Mount Package: 1152-BBGA (35×35) allows high-density PCB layouts while maintaining thermal and mechanical suitability for production assembly.
• RoHS Compliance: Facilitates integration into lead-free manufacturing flows and regulatory-aligned products.

Why Choose 5AGZME5H2F35I3L?

The 5AGZME5H2F35I3L positions itself as a high-capacity, industrial-grade FPGA option for designs that require large programmable logic resources, substantial embedded memory, and broad I/O capabilities in a compact BGA package. Its specified core voltage range and wide operating temperature make it appropriate for engineering teams focused on reliable, long-life deployments in challenging environments.

Engineers and system architects looking to consolidate functionality, reduce external component count, and implement flexible hardware acceleration will find this device suitable for scalable, robust designs where on-chip resources and industrial operation are key considerations.

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