5AGZME3H3F35I4N
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 414 23946240 360000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,044 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 414 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 16980 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 23946240 |
Overview of 5AGZME3H3F35I4N – Arria V GZ FPGA, 360,000 logic elements, 1152-BBGA
The 5AGZME3H3F35I4N is an Intel Arria V GZ field programmable gate array (FPGA) featuring 360,000 logic elements and approximately 23.95 Mbits of embedded RAM. This industrial-grade device combines high logic density, substantial on-chip memory, and a large I/O count to support complex, compute- and I/O-intensive designs.
Designed for surface-mount applications, the device is supplied in a 1152-BBGA (35×35) package and is specified across a wide operating temperature range and a narrow core-voltage window to support stable system-level integration in demanding environments.
Key Features
- Core Logic Capacity 360,000 logic elements and 16,980 logic array blocks (LABs) provide the programmable fabric needed for high-density logic implementation and parallel datapaths.
- Embedded Memory Total on-chip RAM of 23,946,240 bits (approximately 23.95 Mbits) supports large buffering, lookup tables, and state storage without external memory for many functions.
- I/O Density 414 I/O pins enable connectivity to multiple peripherals, buses, and external devices for system-level interfacing and bridging.
- Package & Mounting 1152-BBGA, FCBGA package (supplier device package 1152-FBGA, 35×35) in a surface-mount form factor for compact board-level integration.
- Power Supply Core supply voltage range specified from 820 mV to 880 mV for controlled core power sequencing and design verification.
- Operating Temperature & Grade Industrial grade device rated for −40 °C to 100 °C, suitable for temperature-challenging environments.
- Compliance RoHS-compliant for regulatory and assembly considerations.
- Datasheet Coverage Arria V device documentation includes detailed electrical characteristics, switching characteristics, configuration specifications, and I/O timing to support design validation and system integration.
Typical Applications
- Industrial Control & Automation Industrial-grade temperature rating and large logic/memory resources enable implementation of complex control algorithms and deterministic I/O handling.
- High-density Data Processing Large logic fabric and substantial on-chip RAM support parallel processing, data aggregation, and application-specific acceleration tasks.
- I/O-Intensive Systems 414 I/Os allow consolidation of multiple interfaces, protocol bridging, and system glue logic in a single device.
- System Prototyping and Integration Surface-mount BGA packaging and Arria V family documentation aid rapid evaluation and integration into production boards.
Unique Advantages
- High Integration Density: 360,000 logic elements and ~23.95 Mbits of embedded memory reduce reliance on external components and simplify board-level designs.
- Designed for Harsh Environments: Industrial grade and an operating range from −40 °C to 100 °C support deployment in temperature-challenging applications.
- Extensive I/O Capability: 414 available I/Os give designers flexibility to support multiple interfaces and parallel data paths without additional multiplexing hardware.
- Compact Surface-mount Package: 1152-BBGA (35×35) packaging enables high-density PCB layouts while supporting robust soldered assembly.
- Controlled Core Voltage Range: Specified 0.820–0.880 V supply range helps ensure predictable core behavior and simplifies power-supply design.
- Regulatory Compliance: RoHS compliance facilitates assembly and environmental requirements for commercial and industrial systems.
Why Choose 5AGZME3H3F35I4N?
The 5AGZME3H3F35I4N Arria V GZ FPGA delivers a balance of high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade, surface-mount package. These attributes make it well suited for engineers and system designers implementing complex control, data-processing, and I/O-intensive functions where on-chip resources and reliable operation across a wide temperature range matter.
Backed by detailed Arria V device documentation covering electrical, switching, configuration, and I/O timing specifications, the device supports rigorous design validation and system-level integration for long-term deployment.
Request a quote or submit an inquiry to receive pricing and availability information for the 5AGZME3H3F35I4N Arria V GZ FPGA.

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