5AGZME3H3F35C4G

IC FPGA 414 I/O 1152FBGA
Part Description

Arria V GZ Field Programmable Gate Array (FPGA) IC 414 23946240 360000 1152-BBGA, FCBGA

Quantity 129 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O414Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs16980Number of Logic Elements/Cells360000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits23946240

Overview of 5AGZME3H3F35C4G – Arria V GZ Field Programmable Gate Array (FPGA) IC

The Intel Arria V GZ 5AGZME3H3F35C4G is a high-density field programmable gate array (FPGA) offered in a 1152-pin FCBGA package. It provides substantial on-chip logic and memory resources along with a large I/O count for complex system integration.

With 360,000 logic elements, approximately 24 Mbits of embedded memory, 414 I/Os, and a low-voltage core supply range, this commercial-grade device targets applications that require high integration density, flexible I/O, and commercial temperature operation.

Key Features

  • Core Logic: 360,000 logic elements supporting high-density logic implementations for complex logic and datapath designs.
  • Embedded Memory: Approximately 24 Mbits of on-chip RAM (23,946,240 total RAM bits) to support buffering, FIFOs, and on-chip data structures without external memory.
  • I/O Capacity: 414 I/Os to support broad peripheral connectivity and multi-interface systems.
  • Power & Voltage: Core voltage specified between 820 mV and 880 mV, enabling operation within a defined low-voltage window.
  • Package & Mounting: 1152-pin BBGA (supplier package: 1152-FBGA, 35×35) delivered in a surface-mount form factor for compact, high-pin-count board designs.
  • Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance: RoHS compliant.

Unique Advantages

  • High integration density: 360,000 logic elements allow consolidation of large logic functions and multiple subsystems into a single device, reducing board-level complexity.
  • Large on-chip memory: Approximately 24 Mbits of embedded RAM enables significant local buffering and reduces dependency on external memory components.
  • Extensive I/O capability: 414 I/Os support multiple peripherals and interfaces simultaneously, simplifying system routing and partitioning.
  • Compact high-pin-count package: The 1152-FBGA (35×35) package provides a dense pinout for routing many signals in a compact footprint.
  • Low-voltage core operation: Core supply specified at 820–880 mV supports designs targeting low-voltage FPGA core domains.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a wide range of commercial applications.

Why Choose 5AGZME3H3F35C4G?

The 5AGZME3H3F35C4G Arria V GZ FPGA combines a large logic fabric, substantial on-chip memory, and a high I/O count in a compact 1152-FBGA package. These characteristics make it well suited for designs that require dense logic implementation and flexible interfacing while maintaining a commercial temperature profile.

Backed by Intel’s Arria V family documentation and RoHS compliance, this device offers a solid platform for engineers seeking a scalable, high-capacity FPGA that integrates logic, memory, and I/O resources in a single surface-mount package.

Request a quote or submit a pricing inquiry to learn about availability and lead time for the 5AGZME3H3F35C4G Arria V GZ FPGA.

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