5AGZME3H3F35C4G
| Part Description |
Arria V GZ Field Programmable Gate Array (FPGA) IC 414 23946240 360000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 129 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 414 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 16980 | Number of Logic Elements/Cells | 360000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 23946240 |
Overview of 5AGZME3H3F35C4G – Arria V GZ Field Programmable Gate Array (FPGA) IC
The Intel Arria V GZ 5AGZME3H3F35C4G is a high-density field programmable gate array (FPGA) offered in a 1152-pin FCBGA package. It provides substantial on-chip logic and memory resources along with a large I/O count for complex system integration.
With 360,000 logic elements, approximately 24 Mbits of embedded memory, 414 I/Os, and a low-voltage core supply range, this commercial-grade device targets applications that require high integration density, flexible I/O, and commercial temperature operation.
Key Features
- Core Logic: 360,000 logic elements supporting high-density logic implementations for complex logic and datapath designs.
- Embedded Memory: Approximately 24 Mbits of on-chip RAM (23,946,240 total RAM bits) to support buffering, FIFOs, and on-chip data structures without external memory.
- I/O Capacity: 414 I/Os to support broad peripheral connectivity and multi-interface systems.
- Power & Voltage: Core voltage specified between 820 mV and 880 mV, enabling operation within a defined low-voltage window.
- Package & Mounting: 1152-pin BBGA (supplier package: 1152-FBGA, 35×35) delivered in a surface-mount form factor for compact, high-pin-count board designs.
- Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance: RoHS compliant.
Unique Advantages
- High integration density: 360,000 logic elements allow consolidation of large logic functions and multiple subsystems into a single device, reducing board-level complexity.
- Large on-chip memory: Approximately 24 Mbits of embedded RAM enables significant local buffering and reduces dependency on external memory components.
- Extensive I/O capability: 414 I/Os support multiple peripherals and interfaces simultaneously, simplifying system routing and partitioning.
- Compact high-pin-count package: The 1152-FBGA (35×35) package provides a dense pinout for routing many signals in a compact footprint.
- Low-voltage core operation: Core supply specified at 820–880 mV supports designs targeting low-voltage FPGA core domains.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a wide range of commercial applications.
Why Choose 5AGZME3H3F35C4G?
The 5AGZME3H3F35C4G Arria V GZ FPGA combines a large logic fabric, substantial on-chip memory, and a high I/O count in a compact 1152-FBGA package. These characteristics make it well suited for designs that require dense logic implementation and flexible interfacing while maintaining a commercial temperature profile.
Backed by Intel’s Arria V family documentation and RoHS compliance, this device offers a solid platform for engineers seeking a scalable, high-capacity FPGA that integrates logic, memory, and I/O resources in a single surface-mount package.
Request a quote or submit a pricing inquiry to learn about availability and lead time for the 5AGZME3H3F35C4G Arria V GZ FPGA.

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