5AGZME3H3F35C4N

The 5AGZME3H3F35C4N is an Arria V GZ series Field Programmable Gate Array (FPGA) from Intel, provided in a 1152-ball BGA package. It delivers high logic capacity and on-chip memory in a surface-mount FCBGA footprint for commercial-grade designs.

This device targets designs that require large programmable logic resources, substantial embedded memory, and extensive I/O connectivity while operating at a core supply range of 820 mV to 880 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 360,000 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory  Approximately 24 Mbits of embedded memory for on-chip buffering, tables, and state storage.
• I/O Density  414 user I/O pins to support wide external interfacing and parallel connectivity.
• Power Supply  Core voltage range specified from 820 mV to 880 mV for device operation.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35) designed for surface-mount assembly.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory requirements.

Typical Applications

• High-density programmable logic  Deploy the device where large numbers of logic elements and on-chip memory are required to implement custom digital functions.
• I/O-intensive systems  Use in designs that need a high pin count—414 I/Os—for interfacing to multiple peripherals or parallel buses.
• Embedded processing and buffering  Leverage approximately 24 Mbits of embedded memory for local buffering, lookup tables, and state machines within embedded systems.

Unique Advantages

• Substantial logic resource: The device’s ~360,000 logic elements enable large-scale integration of custom logic without immediate need for external programmable devices.
• Significant on-chip memory: Approximately 24 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count: 414 I/Os provide flexibility for multiple interfaces, sensors, and parallel data paths in complex systems.
• Compact, surface-mount package: 1152-ball FCBGA footprint balances high pin count with a package suitable for modern PCB assembly processes.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, matching typical commercial applications and environments.
• RoHS compliant: Meets environmental compliance expectations for commercial electronic products.

Why Choose 5AGZME3H3F35C4N?

The 5AGZME3H3F35C4N Arria V GZ FPGA provides a combination of large logic capacity, significant embedded memory, and a high I/O count in a commercial-grade, surface-mount FCBGA package. It is well suited for designs that require dense programmable logic, on-chip buffering, and broad external connectivity while operating within a defined core voltage range of 820 mV–880 mV.

Manufactured by Intel and documented as part of the Arria V GZ device family, this FPGA offers a clear specification set for engineering teams specifying high-density programmable logic in commercial applications.

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