5AGZME3H3F35I4G

The 5AGZME3H3F35I4G is an Arria V GZ field programmable gate array (FPGA) supplied in a 1152‑BBGA FCBGA package. It delivers high logic capacity and substantial embedded memory in an industrial‑grade, surface‑mount FPGA suitable for designs that require dense logic, extensive I/O, and wide operating temperature range.

This device is targeted at applications that demand high on‑chip resource integration and robust operation across −40 °C to 100 °C. Core device electrical and configuration characteristics are documented in the Arria V device datasheet for detailed design integration.

Key Features

• High Logic Capacity — 360,000 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 24 Mbits of on‑chip RAM (23,946,240 bits total) for buffering, state storage, and local data structures.
• I/O Resources — 414 I/O to support broad peripheral interfacing and multiple parallel connections.
• Industrial Grade & Temperature Range — Rated for industrial operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Power Supply — Core voltage supply range of 820 mV to 880 mV, supporting defined core power rails.
• Package & Mounting — Surface mount 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35x35).
• RoHS Compliant — Conforms to RoHS directives for lead‑free assembly.

Typical Applications

• Industrial Control and Automation — The industrial temperature rating and high logic density make this device suitable for control algorithms, motor control interfaces, and factory automation systems.
• Signal Processing and Data Aggregation — Large logic resources and embedded RAM enable implementation of custom data paths, buffering, and protocol handling for high‑throughput systems.
• Interface Concentration — With 414 I/O, the device can consolidate multiple peripheral interfaces and handle complex board‑level signal routing.

Unique Advantages

• Substantial On‑Chip Capacity: 360,000 logic elements combined with approximately 24 Mbits of embedded memory reduce reliance on external logic and memory components.
• Wide Operating Range: −40 °C to 100 °C industrial rating supports deployments in harsh or variable temperature environments.
• High I/O Count: 414 I/O simplifies integration of multiple interfaces and sensors without extensive external multiplexing.
• Compact, Surface‑Mount Packaging: 1152‑BBGA FCBGA packaging provides a high‑density footprint for space‑constrained PCBs.
• Standards‑oriented Compliance: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5AGZME3H3F35I4G?

The 5AGZME3H3F35I4G Arria V GZ FPGA balances high logic density, sizeable embedded memory, and a large I/O complement in an industrial‑grade, surface‑mount package. These characteristics make it a strong candidate for systems that require integrated digital processing, extensive interfacing, and reliable operation across a wide temperature range.

Design teams looking for a scalable FPGA fabric with documented electrical and configuration specifications will find this device suitable for advanced embedded systems, industrial automation, and data aggregation roles. Refer to the Arria V device datasheet for comprehensive electrical, timing, and configuration details to guide system integration.

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